公开(公告)号：US20130186449A1

公开(公告)日：2013-07-25

申请号：US13725156

申请日：2012-12-21

Applicant: RESEARCH TRIANGLE INSTITUTE

Inventor： Rama VENKATASUBRAMANIAN ,  Bruce Allen COOK ,  Evgenii M. LEVIN ,  Joel Lee HARRINGA

IPC: H01L35/16

CPC classification number: H01L35/16 ,  C22C1/02 ,  C22C28/00 ,  H01F1/401

Abstract: A thermoelectric material and a thermoelectric converter using this material. The thermoelectric material has a first component including a semiconductor material and a second component including a rare earth material included in the first component to thereby increase a figure of merit of a composite of the semiconductor material and the rare earth material relative to a figure of merit of the semiconductor material. The thermoelectric converter has a p-type thermoelectric material and a n-type thermoelectric material. At least one of the p-type thermoelectric material and the n-type thermoelectric material includes a rare earth material in at least one of the p-type thermoelectric material or the n-type thermoelectric material.

Abstract translation: 使用这种材料的热电材料和热电转换器。 热电材料具有包括半导体材料的第一部件和包括在第一部件中的稀土材料的第二部件，从而相对于品质因数增加半导体材料和稀土材料的复合材料的品质因数 的半导体材料。 热电转换器具有p型热电材料和n型热电材料。 p型热电材料和n型热电材料中的至少一种在p型热电材料或n型热电材料中的至少一种中包括稀土材料。

公开(公告)号：US20130180560A1

公开(公告)日：2013-07-18

申请号：US13725046

申请日：2012-12-21

Applicant: RESEARCH TRIANGLE INSTITUTE

Inventor： Rama VENKATASUBRAMANIAN ,  Phillip BARLETTA ,  Bryson QUILLIAMS ,  Geza DEZSI ,  Thomas COLPITTS ,  Gary BULMAN ,  Judy STUART

IPC: H01L35/28 ,  H01L35/18 ,  H01L35/22 ,  H01L35/16

CPC classification number: H01L35/28 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22 ,  H01L35/32

Abstract: A thermoelectric structure including a thermoelectric material having a thickness less than 50 nm and a semi-insulating material in electrical contact with the thermoelectric material. The thermoelectric material and the semi-insulating materials have an equilibrium Fermi level, across a junction between the thermoelectric material and the semi-insulating material, which exists in a conduction band or a valence band of the thermoelectric material. The thermoelectric structure is for thermoelectric cooling and thermoelectric power generation.

Abstract translation: 包括厚度小于50nm的热电材料和与该热电材料电接触的半绝缘材料的热电结构。 热电材料和半绝缘材料在热电材料和半绝缘材料之间的接合处具有平衡的费米能级，其存在于热电材料的导带或价带中。 热电结构用于热电冷却和热电发电。