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1.发明授权Power device packaging having backmetals couple the plurality of bond pads to the die backside 有权具有背衬的功率器件封装将多个接合焊盘耦合到模具背面公开(公告)号：US09142620B2
公开(公告)日：2015-09-22
申请号：US13910202
申请日：2013-06-05
Applicant: RF Micro Devices, Inc.
Inventor： Andrew P. Ritenour , Paul Partyka
IPC: H01L29/15 , H01L29/66 , H01L21/338 , H01L21/20 , H01L29/20 , H01L21/02 , H01L29/417 , H01L23/36
CPC classification number: H01L29/2003 , H01L21/0254 , H01L23/36 , H01L29/4175 , H01L2224/16 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/00
Abstract: The present disclosure provides a power device and power device packaging. Generally, the power device of the present disclosure includes a die backside and a die frontside. A semi-insulating substrate with epitaxial layers disposed thereon is sandwiched between the die backside and the die frontside. Pads on the die frontside are coupled to the die backside with patterned backmetals that are disposed within vias that pass through the semi-insulating substrate and epitaxial layers from the die backside to the die frontside.
Abstract translation: 本公开提供了功率器件和功率器件封装。 通常，本公开的功率器件包括管芯背面和管芯前端。 具有设置在其上的外延层的半绝缘基板夹在模具背面和模具前侧之间。 模具前端的垫片与模具背面耦合，图案化的背衬设置在通过半绝缘衬底和外延层从模具背面到模具前端的通孔内。
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公开(公告)号：US20140054597A1
公开(公告)日：2014-02-27
申请号：US13910202
申请日：2013-06-05
Applicant: RF Micro Devices, Inc.
Inventor： Andrew P. Ritenour , Paul Partyka
CPC classification number: H01L29/2003 , H01L21/0254 , H01L23/36 , H01L29/4175 , H01L2224/16 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/00
Abstract: The present disclosure provides a power device and power device packaging. Generally, the power device of the present disclosure includes a die backside and a die frontside. A semi-insulating substrate with epitaxial layers disposed thereon is sandwiched between the die backside and the die frontside. Pads on the die frontside are coupled to the die backside with patterned backmetals that are disposed within vias that pass through the semi-insulating substrate and epitaxial layers from the die backside to the die frontside.
Abstract translation: 本公开提供了功率器件和功率器件封装。 通常，本公开的功率器件包括管芯背面和管芯前端。 具有设置在其上的外延层的半绝缘基板夹在模具背面和模具前侧之间。 模具前端的垫片与模具背面耦合，图案化的背衬设置在通过半绝缘衬底和外延层从模具背面到模具前端的通孔内。
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