公开(公告)号：US10365436B2

公开(公告)日：2019-07-30

申请号：US15862463

申请日：2018-01-04

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  David Arlo Nelson ,  Javid Messian ,  Thomas Pierre Schrans

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/42 ,  G02B6/43 ,  F21V8/00 ,  G02B6/122 ,  H01S5/026 ,  G02B6/14 ,  H01S5/02

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

公开(公告)号：US20200073050A1

公开(公告)日：2020-03-05

申请号：US16505674

申请日：2019-07-08

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  David Arlo Nelson ,  Javid Messian ,  Thomas Pierre Schrans ,  Chia-Te Chou ,  Karlheinz Muth

IPC: G02B6/122 ,  H01L31/024 ,  H01L31/02 ,  H01L33/62 ,  H01L33/64

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

公开(公告)号：US20180196196A1

公开(公告)日：2018-07-12

申请号：US15862463

申请日：2018-01-04

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  David Arlo Nelson ,  Javid Messian ,  Thomas Pierre Schrans

IPC: G02B6/13 ,  G02B6/42 ,  G02B6/43 ,  G02B6/14 ,  F21V8/00 ,  G02B6/122 ,  H01S5/026

CPC classification number: G02B6/13 ,  G02B6/0006 ,  G02B6/1225 ,  G02B6/14 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/43 ,  G02B2006/12061 ,  H01S5/021 ,  H01S5/0261

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.