公开(公告)号：US12105333B2

公开(公告)日：2024-10-01

申请号：US18271217

申请日：2022-01-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  William Vis ,  Alexander Gondarenko ,  Shuhe Li ,  David McCann ,  Haydn Frederick Jones ,  Alexander Fast

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/428

Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.

公开(公告)号：US20240077688A1

公开(公告)日：2024-03-07

申请号：US18271217

申请日：2022-01-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  William Vis ,  Alexander Gondarenko ,  Shuhe Li ,  David McCann ,  Haydn Frederick Jones ,  Alexander Fast

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/428

Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.

公开(公告)号：US11860427B2

公开(公告)日：2024-01-02

申请号：US17839405

申请日：2022-06-13

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Albert Benzoni ,  Shuhe Li

IPC: G02B6/42

CPC classification number: G02B6/4245 ,  G02B6/4243

Abstract: The present disclosure includes a method of securing a photonic component to a semiconductor chip, the method including forming a thermosonic bond between the semiconductor chip and a cap to fix the cap against the photonic component. The present disclosure also includes an apparatus including a semiconductor chip having a V-groove, an optical fiber in the V-groove, and a cap secured to the semiconductor chip through a bond including a metal bump, wherein the cap fixes the optical fiber in the V-groove.

公开(公告)号：US12165944B2

公开(公告)日：2024-12-10

申请号：US17550886

申请日：2021-12-14

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Shuhe Li ,  Gerald Cois Byrd

IPC: H01L23/34 ,  H01L23/00

Abstract: An electro-optical package. In some embodiments, the package includes: a carrier; a first integrated circuit, on the carrier; a first bonding layer, between the carrier and the first integrated circuit; a thermoelectric cooler, on the carrier; a second integrated circuit, on the thermoelectric cooler; and a first wire bond. The first wire bond may connect a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit, the first pad and the second pad having a height difference less than 100 microns.