公开(公告)号：US20240077688A1

公开(公告)日：2024-03-07

申请号：US18271217

申请日：2022-01-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  William Vis ,  Alexander Gondarenko ,  Shuhe Li ,  David McCann ,  Haydn Frederick Jones ,  Alexander Fast

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/428

Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.

公开(公告)号：US12119307B2

公开(公告)日：2024-10-15

申请号：US17504125

申请日：2021-10-18

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  Brett Sawyer ,  David McCann

IPC: H01L23/544 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2224/1301 ,  H01L2224/16167 ,  H01L2224/17517 ,  H01L2924/146 ,  H01L2924/15323

Abstract: An assembly. In some embodiments, the assembly includes a first semiconductor chip, a substrate, and a first alignment element. The alignment of the first semiconductor chip and the substrate may be determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip.

公开(公告)号：US12105333B2

公开(公告)日：2024-10-01

申请号：US18271217

申请日：2022-01-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  William Vis ,  Alexander Gondarenko ,  Shuhe Li ,  David McCann ,  Haydn Frederick Jones ,  Alexander Fast

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/428

Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.