公开(公告)号：US12105333B2

公开(公告)日：2024-10-01

申请号：US18271217

申请日：2022-01-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  William Vis ,  Alexander Gondarenko ,  Shuhe Li ,  David McCann ,  Haydn Frederick Jones ,  Alexander Fast

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/428

Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.

公开(公告)号：US20210141172A1

公开(公告)日：2021-05-13

申请号：US17092151

申请日：2020-11-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Yi Zhang ,  Chia-Te Chou ,  William Vis ,  Amit Singh Nagra ,  Hooman Abediasl

IPC: G02B6/42 ,  B41F16/00

Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.

公开(公告)号：US20240077688A1

公开(公告)日：2024-03-07

申请号：US18271217

申请日：2022-01-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  William Vis ,  Alexander Gondarenko ,  Shuhe Li ,  David McCann ,  Haydn Frederick Jones ,  Alexander Fast

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/428

Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.

公开(公告)号：US11520112B2

公开(公告)日：2022-12-06

申请号：US17092151

申请日：2020-11-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Yi Zhang ,  Chia-Te Chou ,  William Vis ,  Amit Singh Nagra ,  Hooman Abediasl

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/125 ,  G02B6/132 ,  G02B6/136

Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.