公开(公告)号：US20160069750A1

公开(公告)日：2016-03-10

申请号：US14710000

申请日：2015-05-12

Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.

Inventor： Jeffrey R. Annis ,  Gary L. Skibinski

IPC: G01K7/00 ,  G01K1/08 ,  H01F27/40 ,  G01K13/00

CPC classification number: G01K7/00 ,  G01K1/08 ,  G01K13/00 ,  H01F27/402 ,  H01F2027/406

Abstract: A thermal well temperature monitoring assembly with high dielectric strength capability is disclosed consisting of a low relative dielectric constant material in a continuous structure that does not have any air voids or pockets. The low relative dielectric constant structure of the thermal well has at least one internal cavity having an end region. A thermal sensor is at least partially located within the at least one internal cavity. The thermal sensor has one or more wires extending out of the end region of the internal cavity. A first low relative dielectric constant potting material encapsulates at least a portion of the thermal sensor within the internal cavity to remove air voids that decrease dielectric strength. A second low relative dielectric constant potting material fills at least a portion of the end region of the internal cavity to provide mechanical ruggedness and environmental sealing.

Abstract translation: 公开了一种具有高绝缘强度能力的热井温度监测组件，其由不具有任何气隙或凹穴的连续结构中的低相对介电常数材料组成。 热阱的低相对介电常数结构具有至少一个具有端部区域的内腔。 热传感器至少部分地位于至少一个内部空腔内。 热传感器具有从内腔的端部区域延伸出的一条或多条线。 第一低相对介电常数灌封材料将内部空腔内的热传感器的至少一部分封装，以去除降低绝缘强度的气隙。 第二低相对介电常数灌封材料填充内腔的端部区域的至少一部分以提供机械坚固性和环境密封。

公开(公告)号：US10317289B2

公开(公告)日：2019-06-11

申请号：US14710000

申请日：2015-05-12

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Jeffrey R. Annis ,  Gary L. Skibinski

IPC: H01F27/40 ,  G01K7/00 ,  G01K13/00 ,  G01K1/08

Abstract: A thermal well temperature monitoring assembly with high dielectric strength capability is disclosed consisting of a low relative dielectric constant material in a continuous structure that does not have any air voids or pockets. The low relative dielectric constant structure of the thermal well has at least one internal cavity having an end region. A thermal sensor is at least partially located within the at least one internal cavity. The thermal sensor has one or more wires extending out of the end region of the internal cavity. A first low relative dielectric constant potting material encapsulates at least a portion of the thermal sensor within the internal cavity to remove air voids that decrease dielectric strength. A second low relative dielectric constant potting material fills at least a portion of the end region of the internal cavity to provide mechanical ruggedness and environmental sealing.