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公开(公告)号:US20220197141A1
公开(公告)日:2022-06-23
申请号:US17124743
申请日:2020-12-17
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventor: Joshua Kaitz , Michael Finch , Paul J. LaBeaume , Shintaro Yamada , Suzanne M. Coley
IPC: G03F7/11 , C08F12/08 , C08F12/22 , C09D125/14 , C09D125/18 , C23C16/02 , C23C16/20 , C23C16/455 , G03F7/16 , H01L21/027
Abstract: A method of forming a pattern on a substrate, the method including: forming a photoresist underlayer over a surface of the substrate, the photoresist underlayer formed from a composition including a polymer having a glass transition temperature of less than 110° C. and a solvent; subjecting the photoresist underlayer to a metal precursor, where the metal precursor infiltrates a free volume of the photoresist underlayer; and exposing the metal precursor-treated photoresist underlayer to an oxidizing agent to provide a metallized photoresist underlayer.
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公开(公告)号:US20220197142A1
公开(公告)日:2022-06-23
申请号:US17124751
申请日:2020-12-17
Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Inventor: Joshua Kaitz , Michael Finch , Paul J. LaBeaume , Shintaro Yamada , Suzanne M. Coley
IPC: G03F7/11 , C08G65/40 , C09D171/12 , C08G73/06 , C09D179/04 , C08F220/18 , C09D133/10 , C23C16/02 , C23C16/20 , C23C16/455 , G03F7/16 , G03F7/42 , H01L21/027
Abstract: A method of forming a pattern on a substrate, the method including: forming a photoresist underlayer over a surface of the substrate, wherein the photoresist underlayer is formed from a composition comprising a polymer and a solvent, and the photoresist underlayer has a carbon content of greater than 47 at %; subjecting the photoresist underlayer to a a metal precursor, where the metal precursor infiltrates a free volume of the photoresist underlayer; and exposing the metal precursor-treated photoresist underlayer to an oxidizing agent to provide a metallized photoresist underlayer.
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