公开(公告)号：US20220190556A1

公开(公告)日：2022-06-16

申请号：US17605457

申请日：2020-04-17

Applicant: ROHM CO., LTD.

Inventor： Satohiro KIGOSHI ,  Yuki TANUMA ,  Gen MUTO ,  Minoru MURAYAMA ,  Okimoto KONDO ,  Chikoto IKEDA ,  Yusuke NAKAKOHARA

IPC: H01S5/042

Abstract: A semiconductor light emitting device includes a substrate, a common conductive portion formed on the substrate, a semiconductor light emitting element mounted on the common conductive portion, and an electronic component mounted on the common conductive portion and electrically connected to the semiconductor light emitting element by the common conductive portion. This structure shortens the conductive path between the semiconductor light emitting element and the electronic component, thereby reducing capacitance caused by the conductive path between the semiconductor light emitting element and the electronic component. Thus, while reducing parasitic capacitance, the semiconductor light emitting element and the electronic component are electrically connected.