公开(公告)号：US20150102744A1

公开(公告)日：2015-04-16

申请号：US14524716

申请日：2014-10-27

Applicant: Rohm Co., Ltd.

Inventor： Gen MUTO

IPC: H05B33/08

CPC classification number: H05B33/08 ,  G03B15/05 ,  G03B2215/0567 ,  G03B2215/0575

Abstract: The LED flash module includes: a module substrate (111); an energy device (18) arranged on the module substrate; an LED module (320) arranged on the module substrate, the LED module in which a plurality of LED block units (320a-320f) are arranged horizontally, the LED block units in which a plurality of LED elements emitting light using a power source supplied from the energy device are arranged vertically; an EDLC charger circuit (311) arranged on the module substrate, and configured to charge the energy device; and an LED driver control circuit (313) arranged on the module substrate, and configured to control light emission from the LED element, wherein a wire length from a plus terminal (321) of the power supply unit to the LED element and a wire length from the LED element to a minus terminal (322) of the power are substantially equivalent with respect to each LED element.

Abstract translation: LED闪光灯模块包括：模块基板（111）; 设置在所述模块基板上的能量装置（18） 布置在模块基板上的LED模块（320），其中多个LED块单元（320a-320f）在水平方向上布置的LED模块，其中使用提供电源的多个LED元件发光的LED块单元 从能量装置垂直排列; EDLC充电器电路（311），被配置为对所述能量装置充电; 以及布置在所述模块基板上并被配置为控制来自所述LED元件的发光的LED驱动器控制电路（313），其中，从所述电源单元的正极端子（321）到所述LED元件的导线长度以及电线长度 从LED元件到功率的负端子（322）相对于每个LED元件基本相等。

公开(公告)号：US20150235931A1

公开(公告)日：2015-08-20

申请号：US14626166

申请日：2015-02-19

Applicant: ROHM CO., LTD.

Inventor： Gen MUTO ,  Hideki SAWADA ,  Tomoki TAKESHITA

IPC: H01L23/495 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L23/49575 ,  H01L23/495 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: A semiconductor device includes a semiconductor chip, a plurality of passive electronic components, a substrate, a main lead, and a sealing resin. The semiconductor chip includes a functional circuit. The plurality of passive electronic components assist a function of the semiconductor chip. The substrate has a principal surface and a reverse surface that face in opposite directions to each other, and the semiconductor chip and the plurality of passive electronic components are mounted on the principal surface. The main lead includes an island portion that is joined to the reverse surface of the substrate, and a terminal portion that is offset in a predetermined direction with respect to the island portion. The sealing resin covers the semiconductor chip, the substrate, and the island portion of the main lead.

Abstract translation: 半导体器件包括半导体芯片，多个无源电子部件，基板，主引线和密封树脂。 半导体芯片包括功能电路。 多个无源电子部件协助半导体芯片的功能。 基板具有彼此相反的主表面和反面，并且半导体芯片和多个无源电子部件安装在主表面上。 主引线包括接合到基板的相反表面的岛部分和相对于岛部分沿预定方向偏移的端子部分。 密封树脂覆盖半导体芯片，基板和主引线的岛部。

公开(公告)号：US20220190556A1

公开(公告)日：2022-06-16

申请号：US17605457

申请日：2020-04-17

Applicant: ROHM CO., LTD.

Inventor： Satohiro KIGOSHI ,  Yuki TANUMA ,  Gen MUTO ,  Minoru MURAYAMA ,  Okimoto KONDO ,  Chikoto IKEDA ,  Yusuke NAKAKOHARA

IPC: H01S5/042

Abstract: A semiconductor light emitting device includes a substrate, a common conductive portion formed on the substrate, a semiconductor light emitting element mounted on the common conductive portion, and an electronic component mounted on the common conductive portion and electrically connected to the semiconductor light emitting element by the common conductive portion. This structure shortens the conductive path between the semiconductor light emitting element and the electronic component, thereby reducing capacitance caused by the conductive path between the semiconductor light emitting element and the electronic component. Thus, while reducing parasitic capacitance, the semiconductor light emitting element and the electronic component are electrically connected.

公开(公告)号：US20150054484A1

公开(公告)日：2015-02-26

申请号：US14528649

申请日：2014-10-30

Applicant: ROHM CO., LTD.

Inventor： Gen MUTO ,  Seitaro MIZUHARA

IPC: H02M3/04 ,  H01L21/52 ,  H01L23/373 ,  H01L23/367 ,  H01L23/055

CPC classification number: H02M3/04 ,  H01L21/52 ,  H01L23/055 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/373 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/19105 ,  H02M7/003 ,  H01L2924/00

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract translation: 直流电压转换模块包括基板，输入端子，输出端子，接地端子，安装在基板上的直流电压转换控制元件，安装在基板上并连接到直流电压转换控制元件和输出端的线圈 端子，安装在基板上并连接到输入端子和接地端子的输入侧电容器，以及安装在基板上并连接到输出端子和接地端子的输出侧电容器。 输入端子，输出端子和接地端子以相互平行的预定的突出方向突出。 接地端子在垂直于突出方向的方向上布置在输入端子和输出端子之间。