公开(公告)号：US20220190556A1

公开(公告)日：2022-06-16

申请号：US17605457

申请日：2020-04-17

Applicant: ROHM CO., LTD.

Inventor： Satohiro KIGOSHI ,  Yuki TANUMA ,  Gen MUTO ,  Minoru MURAYAMA ,  Okimoto KONDO ,  Chikoto IKEDA ,  Yusuke NAKAKOHARA

IPC: H01S5/042

Abstract: A semiconductor light emitting device includes a substrate, a common conductive portion formed on the substrate, a semiconductor light emitting element mounted on the common conductive portion, and an electronic component mounted on the common conductive portion and electrically connected to the semiconductor light emitting element by the common conductive portion. This structure shortens the conductive path between the semiconductor light emitting element and the electronic component, thereby reducing capacitance caused by the conductive path between the semiconductor light emitting element and the electronic component. Thus, while reducing parasitic capacitance, the semiconductor light emitting element and the electronic component are electrically connected.

公开(公告)号：US20180358503A1

公开(公告)日：2018-12-13

申请号：US16061937

申请日：2016-12-13

Applicant: ROHM CO., LTD.

Inventor： Hideyuki UTSUMI ,  Yuki TANUMA

IPC: H01L31/173 ,  H01L33/58 ,  H01L31/0203 ,  H01L31/0232 ,  G01J1/04

CPC classification number: H01L31/173 ,  G01J1/0437 ,  G01V8/12 ,  H01L31/0203 ,  H01L31/02327 ,  H01L33/58

Abstract: An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.

公开(公告)号：US20140022815A1

公开(公告)日：2014-01-23

申请号：US13937859

申请日：2013-07-09

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA

IPC: F21V8/00

CPC classification number: G02B6/0035 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0083 ,  G02B6/0088 ,  G02F1/133615

Abstract: An LED lighting apparatus of the invention includes a substrate having a length in a first direction and a width in a second direction. LED chips are supported on the substrate along the first direction. A light guide, having a thickness in the second direction, includes an incident surface, a reflective surface and an emitting surface. The incident surface faces in a third direction perpendicular to the first and second directions for receiving light emitted from the LED chips. The reflective surface spreads in the first and third directions and reflects light from the incident surface in the second direction. The emitting surface spreads in the first and third directions and allows light from the reflective surface to exit. The substrate is supported by a case that includes side plates around the light guide and a bottom plate connecting the side plates.

Abstract translation: 本发明的LED照明装置包括具有在第一方向上的长度和在第二方向上的宽度的基板。 LED芯片沿着第一方向支撑在基板上。 具有第二方向厚度的导光体包括入射表面，反射表面和发射表面。 入射表面面向与第一和第二方向垂直的第三方向，用于接收从LED芯片发出的光。 反射表面在第一和第三方向上扩展，并且在第二方向上反射来自入射表面的光。 发射表面在第一和第三方向上扩展，并允许来自反射表面的光离开。 基板由包括光导周围的侧板和连接侧板的底板的壳体支撑。

公开(公告)号：US20150003077A1

公开(公告)日：2015-01-01

申请号：US14486385

申请日：2014-09-15

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA ,  Tomoharu HORIO

IPC: F21V5/04

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract translation: 发光器件包括发光元件，连接到发光元件的线以及支撑发光元件的衬底。 衬底形成有在衬底的公共表面中开口的第一凹部和第二凹部。 第一凹部包括第一底表面和连接到第一底表面的第一侧表面，并且发光元件设置在第一底表面上。 第二凹部包括与第二底面连接的第二底面和第二侧面，并且线接合到第二底面。 第一侧表面和第二侧表面都到达公共表面。 第一侧表面连接到第二底表面和第二侧表面。 第一凹部的开口面积大于第二凹部的开口面积。

公开(公告)号：US20130207532A1

公开(公告)日：2013-08-15

申请号：US13852639

申请日：2013-03-28

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA ,  Tomoharu HORIO

IPC: H05B33/02

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

公开(公告)号：US20170012178A1

公开(公告)日：2017-01-12

申请号：US15276508

申请日：2016-09-26

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA ,  Tomoharu HORIO

IPC: H01L33/48 ,  F21V5/04 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58 ,  F21V17/10 ,  F21V7/22

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract translation: 发光器件包括发光元件，连接到发光元件的线以及支撑发光元件的衬底。 衬底形成有在衬底的公共表面中开口的第一凹部和第二凹部。 第一凹部包括第一底表面和连接到第一底表面的第一侧表面，并且发光元件设置在第一底表面上。 第二凹部包括与第二底面连接的第二底面和第二侧面，并且线接合到第二底面。 第一侧表面和第二侧表面都到达公共表面。 第一侧表面连接到第二底表面和第二侧表面。 第一凹部的开口面积大于第二凹部的开口面积。

公开(公告)号：US20150226409A1

公开(公告)日：2015-08-13

申请号：US14613969

申请日：2015-02-04

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA ,  Satoshi UCHIDA ,  Norio YOSHIZAWA ,  Hiroaki WATANABE ,  Takeyuki ADACHI

IPC: F21V19/00 ,  F21V23/00

CPC classification number: H01L33/62 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10454 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light-emitting module is provided with a light-emitting element, a base, and a wiring pattern. The base includes an installation surface facing in a first direction and a mounting surface facing in a second direction which is at right angles to the first direction. The light-emitting element is installed on the installation surface. The wiring pattern is formed on the base and is in electrical contact with the light-emitting element. The base includes a pair of mounting recesses recessed from the mounting surface and spaced from each other in a third direction which is at right angles to both the first direction and the second direction. The wiring pattern includes a pair of mounting-surface electrodes respectively covering at least a part of the pair of mounting recesses.

Abstract translation: 发光模块设置有发光元件，基座和布线图案。 基座包括面向第一方向的安装表面和面向与第一方向成直角的第二方向的安装表面。 发光元件安装在安装面上。 布线图案形成在基底上并与发光元件电接触。 基座包括一对从安装表面凹下的安装凹部，并且在与第一方向和第二方向成直角的第三方向上彼此隔开。 布线图案包括分别覆盖一对安装凹部的至少一部分的一对安装面电极。