公开(公告)号：US20200350478A1

公开(公告)日：2020-11-05

申请号：US16933756

申请日：2020-07-20

Applicant: ROHM CO., LTD.

Inventor： Tomoichiro TOYAMA ,  Hideaki ANZAI ,  Kenya HASHIMOTO ,  Ryo YATAGAI

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/24

Abstract: A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.

公开(公告)号：US20190189878A1

公开(公告)日：2019-06-20

申请号：US16214990

申请日：2018-12-10

Applicant: ROHM CO., LTD.

Inventor： Tomoichiro TOYAMA ,  Hideaki ANZAI ,  Kenya HASHIMOTO ,  Ryo YATAGAI

IPC: H01L33/62 ,  H01L33/24 ,  H01L33/48

Abstract: A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.