公开(公告)号：US20170152996A1

公开(公告)日：2017-06-01

申请号：US15428711

申请日：2017-02-09

Applicant: ROHM CO., LTD.

Inventor： Toshiyuki FUJITA ,  Toshio WATANABE ,  Yusaku KAWABATA

IPC: F21K9/278 ,  H05B33/08 ,  F21S8/04 ,  F21V3/04 ,  F21V15/01 ,  F21V23/00 ,  F21K9/272

CPC classification number: F21K9/278 ,  F21K9/272 ,  F21S4/28 ,  F21S8/02 ,  F21S8/04 ,  F21V3/06 ,  F21V15/01 ,  F21V23/005 ,  F21V23/02 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A lighting device includes a substrate and a planar light source portion including a plurality of LED chips arrayed on the substrate. The planar light source portion faces an illumination space (space to be illuminated) by a predetermined opening area. The plurality of LED chips are arrayed on the substrate such that the mounting density with respect to the opening area is not less than 3/cm2, and accordingly, a planar light source is formed.

公开(公告)号：US20160178174A1

公开(公告)日：2016-06-23

申请号：US15054093

申请日：2016-02-25

Applicant: ROHM CO., LTD.

Inventor： Toshiyuki FUJITA ,  Toshio WATANABE ,  Yusaku KAWABATA

IPC: F21V23/00 ,  H05B33/08 ,  F21V23/02

CPC classification number: F21K9/278 ,  F21K9/272 ,  F21S4/28 ,  F21S8/02 ,  F21S8/04 ,  F21V3/06 ,  F21V15/01 ,  F21V23/005 ,  F21V23/02 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A lighting device includes a substrate and a planar light source portion including a plurality of LED chips arrayed on the substrate. The planar light source portion faces an illumination space (space to be illuminated) by a predetermined opening area. The plurality of LED chips are arrayed on the substrate such that the mounting density with respect to the opening area is not less than 3/cm2, and accordingly, a planar light source is formed.

公开(公告)号：US20170314742A1

公开(公告)日：2017-11-02

申请号：US15650231

申请日：2017-07-14

Applicant: ROHM CO., LTD.

Inventor： Toshiyuki FUJITA ,  Toshio WATANABE ,  Yusaku KAWABATA

IPC: F21K9/278 ,  F21V23/00 ,  F21K9/272 ,  F21S8/04 ,  F21V3/04 ,  H05B33/08 ,  F21V15/01 ,  F21Y2115/10

CPC classification number: F21K9/278 ,  F21K9/272 ,  F21S4/28 ,  F21S8/02 ,  F21S8/04 ,  F21V3/06 ,  F21V15/01 ,  F21V23/005 ,  F21V23/02 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A lighting device includes a substrate having a side extending straight in a first direction and a first LED chip supported by the substrate and having a first anode terminal and a first cathode terminal. The lighting device includes a second LED chip and a third LED chip supported by the substrate, being electrically connected to the second cathode terminal, and being overlapped with the first LED chip when viewed in a second direction that is perpendicular to the first direction. The lighting device includes a connecting portion that connects the first cathode terminal and the second anode terminal with each other, at least a portion of the connecting portion angled at an acute angle with respect to the second direction.

公开(公告)号：US20150138773A1

公开(公告)日：2015-05-21

申请号：US14568935

申请日：2014-12-12

Applicant: ROHM CO., LTD.

Inventor： Toshiyuki FUJITA ,  Toshio WATANABE ,  Yusaku KAWABATA

IPC: F21S4/00 ,  F21V23/02 ,  H05B33/08 ,  F21V23/00

CPC classification number: F21K9/278 ,  F21K9/272 ,  F21S4/28 ,  F21S8/02 ,  F21S8/04 ,  F21V3/06 ,  F21V15/01 ,  F21V23/005 ,  F21V23/02 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H05B33/0803 ,  H05B33/0809 ,  H05B33/0821 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A lighting device includes a substrate and a planar light source portion including a plurality of LED chips arrayed on the substrate. The planar light source portion faces an illumination space (space to be illuminated) by a predetermined opening area. The plurality of LED chips are arrayed on the substrate such that the mounting density with respect to the opening area is not less than 3/cm2, and accordingly, a planar light source is formed.

Abstract translation: 照明装置包括基板和包括排列在基板上的多个LED芯片的平面光源部。 平面光源部分面向预定开口区域的照明空间（待照明空间）。 多个LED芯片排列在基板上，使得相对于开口面积的安装密度不小于3 / cm 2，因此形成平面光源。