公开(公告)号：US11270932B2

公开(公告)日：2022-03-08

申请号：US16590945

申请日：2019-10-02

Applicant: ROHM CO., LTD.

Inventor： Hideaki Yamaji

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/29 ,  H01L29/861 ,  H01L21/56 ,  H01L21/304

Abstract: A chip part includes a chip main body which has a first main surface at one side, a second main surface at the other side and side surfaces that connect the first main surface and the second main surface and which includes a terminal electrode exposed from the first main surface, and an outer surface resin which exposes the first main surface of the chip main body and covers an outer surface of the chip main body.

公开(公告)号：US11769705B2

公开(公告)日：2023-09-26

申请号：US17091031

申请日：2020-11-06

Applicant: ROHM Co., LTD.

Inventor： Katsuya Matsuura ,  Yasuhiro Kondo ,  Hideaki Yamaji

IPC: H01L23/31 ,  H01L21/78 ,  H01L21/56 ,  H01L29/866 ,  H01L49/02

CPC classification number: H01L23/3185 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3192 ,  H01L23/3178 ,  H01L28/20 ,  H01L28/60 ,  H01L29/866

Abstract: Disclosed is a chip component including a substrate having a first surface and a second surface on an opposite side from the first surface, and a third surface connecting the first surface and the second surface to each other, an external surface resin configured to cover at least the third surface of the substrate, and a terminal electrode formed on the first surface of the substrate and exposed from the external surface resin. A recessed portion is formed in an end portion of the third surface of the substrate, the end portion being on the first surface side. The external surface resin is embedded in the recessed portion.