Abstract:
The invention relates to a method which comprises the steps of providing a plate (2) made of a micromachinable material, forming the timepiece component (1) with at least one attachment (3) for keeping the component attached to the rest of the plate (2), by etching the plate (2); and creating, along a desired breakage line of the attachment, a pre-detachment area (4) comprising at least one gap (5) obtained by etching into the body of the plate (2).
Abstract:
A method of manufacturing a clock or watch component (19; 29) includes (i) providing (E11; E21) a wafer (11; 21) having a single slice (12; 22) including a material of the component, notably silicon, diamond, quartz, sapphire or ceramic, optionally first coating the lower surface of the slice (22) with a lower layer (24), (iii) etching (E12 to E14; E22 to E24) the slice (12; 22) starting from its upper surface to form at least one clock or watch component, (iv) revealing (E15; E25) at least one clock or watch component (19; 29), by removing a layer that served as a mask for etching (E15; E25) and (y) optionally releasing (E26) the slice and the at least one etched clock or watch component by removing the lower layer (24).
Abstract:
A method of manufacturing a clock or watch component (19; 29) includes (i) providing (Ell; E21) a wafer (11; 21) having a single slice (12; 22) including a material of the component, notably silicon, diamond, quartz, sapphire or ceramic, optionally first coating the lower surface of the slice (22) with a lower layer (24), (iii) etching (E12 to E14; E22 to E24) the slice (12; 22) starting from its upper surface to form at least one clock or watch component, (iv) revealing (E15; E25) at least one clock or watch component (19; 29), by removing a layer that served as a mask for etching (E15; E25) and (y) optionally releasing (E26) the slice and the at least one etched clock or watch component by removing the lower layer (24).
Abstract:
Process for manufacturing a hybrid timepiece component, comprising structuring at least one wafer (14) of a first micromachinable material so as to form at least one through-opening (15) within the wafer (14), said structured wafer (14) being intended to form a first part (4) of the hybrid timepiece component; and depositing a metal by electroforming, so that the metal extends through the through-opening (15) and over the two upper and lower faces of the wafer (14) as a single piece resulting from one and the same electroforming step, the electroformed metal being intended to form a second part (8) of the hybrid timepiece component.
Abstract:
The invention relates to a method which comprises the steps of providing a plate (2) made of a micromachinable material, forming the timepiece component (1) with at least one attachment (3) for keeping the component attached to the rest of the plate (2), by etching the plate (2); and creating, along a desired breakage line of the attachment, a pre-detachment area (4) comprising at least one gap (5) obtained by etching into the body of the plate (2).
Abstract:
A balance spring for an oscillator of a timepiece, wherein it comprises a component part, in particular at least a coil or a portion of a coil, provided with heavily doped silicon having an ion density greater than or equal to 1018 at/cm3, in order to permit the thermo-compensation of the oscillator.
Abstract:
A method for determining an imbalance characteristic of a hairspring (5) balance (4) oscillator (3) of a timepiece movement (2), the method comprising at least the following steps: —Setting the hairspring balance oscillator in an oscillating motion at at least two amplitudes, —Determining, for each amplitude and for at least two positions of the oscillator, a piece of data representative of the oscillation period of the oscillator, —Using the data from the previous step to calculate the imbalance characteristic of the hairspring balance oscillator.
Abstract:
The manufacturing process produces a part (10), from a micromachinable material, the part (10) forming a blank of the timepiece component and comprising at least one surface having an initial roughness. It comprises a step of mechanical strengthening treatment of the part in an etching fluid intended to decrease the roughness of said surface. For example, a substrate of said micromachinable material is provided; the substrate is at least partially covered with a protective coating containing at least one aperture; the substrate is etched through the aperture in the protective coating and an etched surface is thus obtained; the mechanical strengthening treatment is applied to said etched surface through the aperture in the protective coating; and then the protective coating is removed. The etching fluid may be a plasma or a liquid chemical etchant.
Abstract:
The invention relates to a method which comprises the steps of providing a plate (2) made of a micromachinable material, forming the timepiece component (1) with at least one attachment (3) for keeping the component attached to the rest of the plate (2), by etching the plate (2); and creating, along a desired breakage line of the attachment, a pre-detachment area (4) comprising at least one gap (5) obtained by etching into the body of the plate (2).
Abstract:
A balance spring for an oscillator of a timepiece, wherein it comprises a component part, in particular at least a coil or a portion of a coil, provided with heavily doped silicon having an ion density greater than or equal to 1018 at/cm3, in order to permit the thermo-compensation of the oscillator.