THERMAL CONTROLLER
    2.
    发明申请
    THERMAL CONTROLLER 有权
    热控制器

    公开(公告)号:US20140225659A1

    公开(公告)日:2014-08-14

    申请号:US14167088

    申请日:2014-01-29

    CPC classification number: H03K17/145 H01L2924/0002 H01L2924/00

    Abstract: A thermal controller for driving a gate control unit of a gate-driven semiconductor switching device, the thermal controller comprising a junction temperature estimation module for generating an estimated junction temperature for the switching device, a gate voltage control module for modifying a gate voltage of the switching device, a switching frequency control module for modifying a switching frequency of the switching device, and a duty cycle control module for modifying the duty cycle of the switching device. In use, the thermal controller is adapted to activate one of the gate voltage control module, switching frequency control module and duty cycle control module dependent upon the estimated junction temperature in order to maintain the actual junction temperature below a pre-determined limit.

    Abstract translation: 一种用于驱动栅极驱动半导体开关器件的栅极控制单元的热控制器,所述热控制器包括用于产生所述开关器件的估计结温的结温估计模块,用于修改所述栅极电压的栅极电压的栅极电压控制模块 开关装置,用于修改开关装置的开关频率的开关频率控制模块,以及用于修改开关装置的占空比的占空比控制模块。 在使用中,热控制器适于根据估计的结温激活门电压控制模块,开关频率控制模块和占空比控制模块中的一个,以便将实际结温保持在预定极限以下。

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