摘要:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
摘要:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
摘要:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
摘要:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
摘要:
Acrylic copolymer pressure sensitive adhesive compositions containing surface-modified nanoparticles are described. The surface-modified nanoparticles are based on nanoparticles having a silica surface and a plurality of silane surface-modifying groups covalently bonded to the silica surface. Although some of the silane surface modifying groups may be non-reactive, at least 25 mole percent, and up to 100 mole percent, of the silane surface-modifying groups are reactive silane surface-modifying groups.
摘要:
A pre-adhesive syrup polymer composition is described comprising an acid-functional (meth)acrylate copolymer and an aminoalkyl (meth)acryloyl solvent monomer, which when polymerized, provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
摘要:
A pre-adhesive syrup copolymer composition comprising an acid functional acrylate solute copolymer, a monomer solvent mixture, and a polyaziridine crosslinking agent is disclosed.
摘要:
A pre-adhesive syrup polymer composition is described comprising an acid-functional (meth)acrylate copolymer and an aminoalkyl (meth)acryloyl solvent monomer, which when polymerized, provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
摘要:
Compositions such as photoresists and microfabrication processes are provided that can produce high-fidelity microfabricated structures. The provided photoresists can have reduced swelling during the development phase and can give tight tolerances for products, such as microneedles, that can be used, for example, in the medical field. The provided compositions include a photoresist, a photoinitiator system dispersed in the photoresist, and a polymer-tethered nanoparticle dispersed in the photoresist. The photoresist can be a negative photoresist and the photoinitiator system can include a two-photoinitiator system. The polymer-tethered nanoparticle can include an acrylic polymer and, in some embodiments, can include poly(methyl methacrylate). The nanoparticles can include silica.
摘要:
Pressure sensitive adhesives comprising an acrylate polymer and surface-modified nanoparticles are described. The surface-modified nanoparticles comprise a nanoparticle having a silica surface and surface modifying groups covalently attached to the silica surface. At least one surface-modifying group is a polymeric silane surface modifying group. At least one surface-modifying group is a non-polymeric silane surface modifying group. Methods of preparing such adhesives, including their exposure to UVA and UVC radiation are also described.