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1.Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects 失效
标题翻译: 用于集成电路金属互连的低选择性化学机械抛光(CMP)工艺公开(公告)号:US6045435A
公开(公告)日:2000-04-04
申请号:US905757
申请日:1997-08-04
申请人: Rajeev Bajaj , Subramoney Iyer , Thom Kobayashi , Jaime Saravia , Mark Fernandes , David K. Watts
发明人: Rajeev Bajaj , Subramoney Iyer , Thom Kobayashi , Jaime Saravia , Mark Fernandes , David K. Watts
IPC分类号: B24B37/04 , B24D13/14 , H01L21/321 , H01L21/768 , B24B1/00
CPC分类号: B24B37/24 , B24B37/042 , B24B37/26 , H01L21/3212 , H01L21/7684
摘要: A method for polishing a metal layer (20) containing a combination of wide features (12), low density features (14), and high density features (18), is illustrated. A hydrophilic polish pad (24) having a shore D hardness of greater than 50 is used along with slurry (22) containing silica and an acidic based oxidizer such as oxadic acid in a chemical mechanical polishing (CMP) process. The result is less than 5:1 and preferably 1:1. This low selectivity results in the metal layer (20) being polished to a level below the surface of the surrounding oxide in a timed-controlled polish.
摘要翻译: 示出了用于抛光包含宽特征(12),低密度特征(14)和高密度特征(18)的组合的金属层(20)的方法。 在化学机械抛光(CMP)工艺中,与含有二氧化硅和酸性氧化剂如草酸的浆料(22)一起使用具有大于50的肖氏D硬度的亲水抛光垫(24)。 结果小于5:1,优选为1:1。 这种低选择性导致金属层(20)以定时控制的抛光剂抛光到周围氧化物表面以下的水平。
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公开(公告)号:USD645131S1
公开(公告)日:2011-09-13
申请号:US29359896
申请日:2010-04-16
申请人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
设计人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
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公开(公告)号:USD659453S1
公开(公告)日:2012-05-15
申请号:US29390388
申请日:2011-04-25
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公开(公告)号:USD647187S1
公开(公告)日:2011-10-18
申请号:US29359893
申请日:2010-04-16
申请人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
设计人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
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公开(公告)号:USD646768S1
公开(公告)日:2011-10-11
申请号:US29359894
申请日:2010-04-16
申请人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
设计人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
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公开(公告)号:USD658915S1
公开(公告)日:2012-05-08
申请号:US29390389
申请日:2011-04-25
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公开(公告)号:USD647186S1
公开(公告)日:2011-10-18
申请号:US29359886
申请日:2010-04-16
申请人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
设计人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
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公开(公告)号:USD637274S1
公开(公告)日:2011-05-03
申请号:US29359889
申请日:2010-04-16
申请人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
设计人: Dennis Chan , Mark Fernandes , Peter Kay , Stuart King , Paul Marrs , Dan Tyce , Chris Witty , Simon Woolley
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公开(公告)号:USD361153S
公开(公告)日:1995-08-08
申请号:US6366
申请日:1993-03-25
申请人: Mark Fernandes
设计人: Mark Fernandes
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公开(公告)号:USD660061S1
公开(公告)日:2012-05-22
申请号:US29390387
申请日:2011-04-25
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