公开(公告)号：US08083124B1

公开(公告)日：2011-12-27

申请号：US07615553

申请日：1990-11-19

申请人： Ramgopal Darolia ,  Warren Davis Grossklaus, Jr. ,  Murray Sawyer Smith ,  David Michael Matey ,  Paul Wencil Stanek

发明人： Ramgopal Darolia ,  Warren Davis Grossklaus, Jr. ,  Murray Sawyer Smith ,  David Michael Matey ,  Paul Wencil Stanek

IPC分类号： B23K1/00 ,  B23K5/00 ,  B23K20/26 ,  B23K20/00 ,  B23K23/00

CPC分类号： B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K2101/001 ,  B23K2103/26 ,  C22C19/056 ,  C22C19/057 ,  C22F1/10 ,  C30B29/52 ,  C30B33/06 ,  F01D5/147 ,  F01D5/16 ,  F05D2230/22 ,  F05D2230/233 ,  F05D2230/234

摘要： A method for joining a plurality of single crystal members includes providing a bonding foil with a composition match with that of the members and with a bonding temperature within the gamma prime solution temperature range of the members, but below the melting temperature of the foil and below the incipient melting temperature of the members. The foil is disposed between and in contact with opposing members to be joined while heated to and held at the bonding temperature for at least 10 hours.

摘要翻译： 一种用于连接多个单晶构件的方法包括提供具有与构件的组成匹配的组合物的接合箔和在构件的γ'溶液温度范围内的粘合温度，但低于箔的熔化温度和低于 成员的初始熔化温度。 箔被设置在相对的构件之间并且与待接合的相接构件接触，同时被加热并保持在接合温度下至少10小时。