公开(公告)号：US20090194910A1

公开(公告)日：2009-08-06

申请号：US12023915

申请日：2008-01-31

申请人： Raymond Rosner ,  Darrin Albert MacLeod ,  Abdeslam Bouti

发明人： Raymond Rosner ,  Darrin Albert MacLeod ,  Abdeslam Bouti

IPC分类号： B29C45/20

CPC分类号： B29C45/2725 ,  B29C2045/277 ,  B29C2045/2798

摘要： A two stage spring pack device comprising a nozzle or back up insulator, surrounded by a first stage spring for applying an initial force, and a plurality of Belleville springs to exert a secondary force against a thermally expanding hot runner manifold in an injection molding system, precludes resin leakage between a manifold and nozzle or between mating manifolds in a cross manifold system. The first stage spring imparts a relatively low initial force against the hot runner components while the system heats up from ambient temperature to prevent plate bowing and component hobbing, until it is fully compressed, at which point a subsequently larger sealing force is exerted by the constant force Belleville springs to prevent leakage between the mating components at operating temperature and injection pressure.

摘要翻译： 包括由用于施加初始力的第一级弹簧包围的喷嘴或备用绝缘体的两级弹簧组装置和多个贝氏弹簧，以在注塑系统中对热膨胀的热流道歧管施加次级力， 排除歧管和喷嘴之间的树脂泄漏或交叉歧管系统中的配合歧管之间的树脂泄漏。 第一阶段弹簧对热流道部件施加相对低的初始力，同时系统从环境温度升高以防止板弯曲和部件滚动，直到其被完全压缩，此时随后更大的密封力由常数施加 力Belleville弹簧防止配合部件在工作温度和注射压力下的泄漏。

公开(公告)号：US20060003041A1

公开(公告)日：2006-01-05

申请号：US10880494

申请日：2004-07-01

申请人： Raymond Rosner

发明人： Raymond Rosner

IPC分类号： B29C45/13 ,  B29C45/74

CPC分类号： B29C45/1603 ,  B29C45/02 ,  B29C45/2737 ,  B29C2045/1609 ,  B29C2045/2785

摘要： Coinjection molding nozzle apparatus and method includes structure and/or steps whereby a first nozzle melt channel is kept thermally separated from a second nozzle melt channel. Preferably, grooves in the nozzle body or a separate nozzle pipe keep the first and second nozzle melt channels thermally separated. Preferably, a highly thermally conductive nozzle tip is removably coupled to the nozzle body and includes first and second nozzle tip melt channels that merge together before the mold gate.

摘要翻译： 共注射成型喷嘴装置和方法包括结构和/或步骤，其中第一喷嘴熔体通道与第二喷嘴熔体通道保持热分离。 优选地，喷嘴主体中的凹槽或单独的喷嘴管将第一和第二喷嘴熔体通道热分离。 优选地，高度导热的喷嘴尖端可拆卸地联接到喷嘴主体并且包括在模具浇口之前合并在一起的第一和第二喷嘴尖端熔融通道。

公开(公告)号：US20050071788A1

公开(公告)日：2005-03-31

申请号：US10605379

申请日：2003-09-26

申请人： Jeanne Bickford ,  Edward Evans ,  Sean Horner ,  Raymond Rosner ,  Andrew Wienick ,  Joseph Yoder

发明人： Jeanne Bickford ,  Edward Evans ,  Sean Horner ,  Raymond Rosner ,  Andrew Wienick ,  Joseph Yoder

IPC分类号： G06F17/50

CPC分类号： G06F17/5045

摘要： A method and system for predicting manufacturing yield for a proposed integrated circuit The method includes: in the order recited: (a) providing a multiplicity of different integrated circuit library elements in a design database, each library element linked to a corresponding normalization factor in the design database; (b) selecting library elements from the design database to include in a proposed design for the integrated circuit; (c) generating an equivalent circuit count of the proposed design based on the normalization factors and a count of each different library element included in the proposed design; and (d) calculating a predicted manufacturing yield based on the equivalent circuit count, a predicted density of manufacturing defects and an area of the proposed integrated circuit chip.

摘要翻译： 一种用于预测所提出的集成电路的制造产量的方法和系统。该方法包括：按照所述的顺序：（a）在设计数据库中提供多个不同的集成电路库元件，每个库元件链接到相应的归一化因子 设计数据库; （b）从设计数据库中选择库元素以包含在集成电路的拟议设计中; （c）基于归一化因子和所提出的设计中包括的每个不同的库元素的计数产生所提出的设计的等效电路数; 以及（d）基于等效电路数，制造缺陷的预测密度和所提出的集成电路芯片的面积来计算预计制造产量。