公开(公告)号：US10010020B2

公开(公告)日：2018-06-26

申请号：US14847620

申请日：2015-09-08

Applicant: Raytheon Company

Inventor： Travis Mayberry ,  Jeffrey A. Shubrooks

IPC: B32B37/00 ,  H05K13/04 ,  H05K1/02 ,  H05K3/14

CPC classification number: H05K13/0404 ,  B33Y80/00 ,  H05K1/0272 ,  H05K3/14 ,  H05K2201/064 ,  H05K2203/0285

Abstract: A machine is provided and includes a machine body formed to define a single enclosed space, an ultrasonic consolidation (UC) processing element operably disposed in the single enclosed space for executing UC processing of a part within the single enclosed space and an electronics printing element operably disposed in the single enclosed space for executing electronics printing of the part within the single enclosed space.

公开(公告)号：US20190269050A1

公开(公告)日：2019-08-29

申请号：US16286947

申请日：2019-02-27

Applicant: Raytheon Company

Inventor： James A. Robbins ,  Jeffrey A. Shubrooks

IPC: H05K13/04 ,  H05K3/34 ,  H01L23/00

Abstract: A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.

公开(公告)号：US20170071083A1

公开(公告)日：2017-03-09

申请号：US14847620

申请日：2015-09-08

Applicant: Raytheon Company

Inventor： Travis Mayberry ,  Jeffrey A. Shubrooks

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0404 ,  H05K1/0272 ,  H05K3/14 ,  H05K2201/064 ,  H05K2203/0285

Abstract: A machine is provided and includes a machine body formed to define a single enclosed space, an ultrasonic consolidation (UC) processing element operably disposed in the single enclosed space for executing UC processing of a part within the single enclosed space and an electronics printing element operably disposed in the single enclosed space for executing electronics printing of the part within the single enclosed space.

Abstract translation: 设置机器并且包括形成为限定单个封闭空间的机体，可操作地设置在单个封闭空间中的超声波固结（UC）处理元件，用于执行单一封闭空间内的部件的UC处理和电子打印元件，其可操作地 设置在单个封闭空间中，用于在单个封闭空间内执行部件的电子打印。

公开(公告)号：US11330746B2

公开(公告)日：2022-05-10

申请号：US16286947

申请日：2019-02-27

Applicant: Raytheon Company

Inventor： James A. Robbins ,  Jeffrey A. Shubrooks

IPC: H05K13/04 ,  H05K3/34 ,  H01L23/00 ,  H01L21/56

Abstract: A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.