公开(公告)号：US11688820B2

公开(公告)日：2023-06-27

申请号：US17066735

申请日：2020-10-09

Applicant: Regents of the University of Minnesota

Inventor： Sang-Hyun Oh ,  Daehan Yoo

IPC: H01L31/108 ,  H01L31/18 ,  H01L31/028 ,  H01L31/0224

CPC classification number: H01L31/1085 ,  H01L31/028 ,  H01L31/022416 ,  H01L31/1808

Abstract: The subject matter of this specification can be embodied in, among other things, a photodetector that includes a semiconductor substrate, a semiconductor annulus on a planar face of the semiconductor substrate, and a metal layer on the semiconductor substrate, wherein the metal layer comprises a first region surrounding the semiconductor annulus and comprises a second region filling an interior region to the semiconductor annulus, and the metal layer in the first region forms a Schottky junction with the semiconductor ring.

公开(公告)号：US20210111298A1

公开(公告)日：2021-04-15

申请号：US17066735

申请日：2020-10-09

Applicant: Regents of the University of Minnesota

Inventor： Sang-Hyun Oh ,  Daehan Yoo

IPC: H01L31/108 ,  H01L31/0224 ,  H01L31/028 ,  H01L31/18

Abstract: The subject matter of this specification can be embodied in, among other things, a photodetector that includes a semiconductor substrate, a semiconductor annulus on a planar face the semiconductor substrate, and a metal layer on the semiconductor substrate, wherein the metal layer comprises a first region surrounding the semiconductor annulus and comprises a second region filling an interior region to the semiconductor annulus, and the metal layer in the first region forms a Schottky junction with the semiconductor ring.