专利检索 ap:("Renesas Electronics Corporation") AND inv:"Zen TOMIZAWA" 第 1 页

1.

发明公开
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PROVIDING CHIPSET 审中-公开

公开(公告)号：US20240312968A1

公开(公告)日：2024-09-19

申请号：US18588573

申请日：2024-02-27

申请人： Renesas Electronics Corporation

发明人： Toshiyuki HATA , Zen TOMIZAWA

IPC分类号： H01L25/16 , H01L23/00 , H01L23/34 , H01L23/495

CPC分类号： H01L25/16 , H01L23/34 , H01L23/49524 , H01L24/40 , H01L24/83 , H01L2224/40221 , H01L2224/83192 , H01L2924/13091

摘要： A semiconductor device including: a first semiconductor chip having a first power transistor and a temperature sensing diode; and a second semiconductor chip having a second power transistor, but not having a temperature sensing diode.