专利检索 ap:("Resonac Corporation") AND inv:"Arisa YAMAKAWA" 第 1 页

1.

发明公开
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD 审中-公开

公开(公告)号：US20240337934A1

公开(公告)日：2024-10-10

申请号：US18291075

申请日：2021-12-22

申请人： Resonac Corporation

发明人： Naoki YAMASHITA , Hayato SAWAMOTO , Kaho YAMAGUCHI , Yasuyuki OYAMA , Arisa YAMAKAWA

IPC分类号： G03F7/033 , G03F7/105 , G03F7/115 , H05K3/00 , H05K3/28

CPC分类号： G03F7/033 , G03F7/105 , G03F7/115 , H05K3/0082 , H05K3/287

摘要： The present disclosure relates to a photosensitive resin composition for a permanent resist, the photosensitive resin composition including: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerization initiator; and (C) a photopolymerizable compound, in which the photopolymerizable compound includes a photopolymerizable compound having four or more ethylenically unsaturated groups and a photopolymerizable compound having three or fewer ethylenically unsaturated groups.