公开(公告)号：US06239987B1

公开(公告)日：2001-05-29

申请号：US08218802

申请日：1994-03-28

申请人： Richard Sheng-Tong Shyr ,  Enrico F. Napoletano ,  Marie Guillot

发明人： Richard Sheng-Tong Shyr ,  Enrico F. Napoletano ,  Marie Guillot

IPC分类号： H02H104

CPC分类号： H01L23/057 ,  H01L24/72 ,  H01L25/115 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/00

摘要： First and second thermoplastic case parts house a surge protector semiconductor subassembly having a plurality of components. The first and second thermoplastic case parts are substantially identical, and each case part has a semiconductor subassembly receiving recess therein. The first and second thermoplastic case parts have corresponding projections and recesses so that the first and second thermoplastic case parts may be snapped together to form a hollow case encapsulating the semiconductor subassembly. The hollow case includes spring means integral with the hollow case for applying force on the semiconductor subassembly to retain the components of the semiconductor subassembly together in the event that the case is subjected to high temperature due to a high current surge.

摘要翻译： 第一和第二热塑性壳体部件容纳具有多个部件的浪涌保护器半导体子组件。 第一和第二热塑性壳体部件基本相同，并且每个壳体部件在其中具有半导体子组件容纳凹部。 第一和第二热塑性壳体部件具有对应的突起和凹槽，使得第一和第二热塑性壳体部件可以卡扣在一起以形成封装半导体子组件的中空壳体。 中空壳体包括与中空壳体一体的弹簧装置，用于在半导体子组件上施加力，以在壳体由于高电流浪涌而受到高温的情况下将半导体子组件的部件保持在一起。

公开(公告)号：US5512784A

公开(公告)日：1996-04-30

申请号：US229555

申请日：1994-04-19

申请人： Robert L. Fried ,  Enrico F. Napoletano ,  Marie Guillot

发明人： Robert L. Fried ,  Enrico F. Napoletano ,  Marie Guillot

IPC分类号： H01L23/495 ,  H01L29/861 ,  H01L23/34

CPC分类号： H01L23/49562 ,  H01L2224/32245 ,  H01L2924/13034

摘要： The subassembly of the present invention includes three pairs of aligned steering diodes and a single thyristor situated between spaced apart conductive heat sink plates. The subassembly is configured to fit into a standard 3-lead transistor outline package by arrangement of the semiconductors and shaping of the conductive plates. In one embodiment, the plates are square, and the components are arranged such that the diode pairs and thyristor are proximate the corners of the plates. In another embodiment, a "T" arrangement is utilized for the components which are situated between "H" shaped plates.

摘要翻译： 本发明的子组件包括三对对准的转向二极管和位于间隔开的导电散热板之间的单个晶闸管。 子组件被配置成通过半导体的布置和导电板的成形装配到标准的3引脚晶体管外形封装中。 在一个实施例中，板是正方形的，并且组件被布置成使得二极管对和晶闸管接近板的角。 在另一个实施例中，对于位于“H”形板之间的部件使用“T”布置。