公开(公告)号：US20050186711A1

公开(公告)日：2005-08-25

申请号：US10868171

申请日：2004-06-15

申请人： Richard Yee ,  Chee Wong ,  Chee Yip ,  Sasidharan Suresh Dass ,  Kam Lau ,  Kok Goh

发明人： Richard Yee ,  Chee Wong ,  Chee Yip ,  Sasidharan Suresh Dass ,  Kam Lau ,  Kok Goh

IPC分类号： B29C45/14 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60

CPC分类号： H01L21/565 ,  B29C45/14418 ,  B29C45/14655 ,  H01L21/4842 ,  H01L2924/0002 ,  H01L2924/00

摘要： A mould for encapsulating an integrated circuit package on a leadframe including a top mould-half and a complementary bottom mould-half enclosing a cavity for encapsulating said package wherein structures are provided on at least one of said mould-halves which, upon the closure of said mould-halves, closes off the spaces between adjacent leads of the leadframe to allow only said leads to extend out of said cavity. The structures may be protrusions from the mould half closing off the spaces. Notches or slots cut to allow the leads' extension are the preferred structures due to ease of machining. The mould design thus enables a leadframe package to be moulded with a peripheral flange as narrow as desired without the need to cut a broad conventional flange formed up to the dam bar because only the leads and tie bars are left to be singulated. A method for making the above mould as well as singulation methods for cutting and punching the leads and tie bars is also disclosed.

摘要翻译： 一种用于将集成电路封装封装在引线框架上的模具，该引线框架包括顶部模具半部和互补的底部模具半部，该模具半部包围用于封装所述封装件的空腔，其中结构设置在所述模具半部中的至少一个上， 所述模具半部封闭引线框架的相邻引线之间的空间，以仅允许所述引线延伸出所述空腔。 结构可以是从模具半部封闭空间的突起。 由于加工容易，切槽或切槽允许引线延伸是优选的结构。 因此，模具设计使得引线框架封装可以根据需要被模制成具有窄的外围法兰，而不需要切割形成到坝条的宽的常规凸缘，因为只有引线和连接条被分割。 还公开了用于制造上述模具的方法以及用于切割和冲压引线和连接杆的切割方法。

公开(公告)号：US20080016486A1

公开(公告)日：2008-01-17

申请号：US11417451

申请日：2006-05-03

申请人： Yuen Chan ,  Yong Han Low ,  Yue Huang ,  Kok Goh ,  Kok Tan

发明人： Yuen Chan ,  Yong Han Low ,  Yue Huang ,  Kok Goh ,  Kok Tan

IPC分类号： G06F17/50 ,  H03K19/00 ,  H01L21/66 ,  G01R31/26

CPC分类号： G06F17/5045 ,  G06F17/504

摘要： A system for assessing reliability of a semiconductor product design, the system comprising a first database for storing circuits data specifying cells of available circuits for semiconductor products; an input unit for input of reliability qualification data of tested semiconductor products; an uploading unit for uploading semiconductor product design data; and a processor for processing the reliability qualification data to generate reliability data at a circuit-level, a cell-level, or both utilizing the circuits data, and for assessing the reliability of the semiconductor product design based on the generated reliability data.

摘要翻译： 一种用于评估半导体产品设计的可靠性的系统，所述系统包括：第一数据库，用于存储指定用于半导体产品的可用电路单元的电路数据; 用于输入测试半导体产品的可靠性鉴定数据的输入单元; 用于上传半导体产品设计数据的上传单元; 以及处理器，用于处理可靠性鉴定数据，以便利用电路数据在电路级，单元级或两者产生可靠性数据，以及基于所生成的可靠性数据来评估半导体产品设计的可靠性。

公开(公告)号：US20050170687A1

公开(公告)日：2005-08-04

申请号：US11096489

申请日：2005-03-31

申请人： Kok Goh

发明人： Kok Goh

IPC分类号： G06F1/18 ,  H01R13/518 ,  H01R13/73 ,  H02G11/00 ,  H01R13/72

CPC分类号： H02G11/00 ,  G06F1/181 ,  G06F1/183 ,  G06F1/189 ,  H01R13/518 ,  H01R13/73

摘要： There is disclosed an organizing apparatus, to flexibly relocate the computer port or socket to the front, such that connection of computer peripherals becomes simpler. There are also disclosed apparatus accessories to flexibly relocate the computer port or socket to the front. The apparatus and the accessories can also be used to flexibly hold and secure electrical devices and electrical components at the front of the computer system. The organizing apparatus can be incorporated into a computer or computer casing. The organizing apparatus may also be provided with cable organizing means, wherein access cables of the computer system can be organized and stored within its housing.

摘要翻译： 公开了一种组装设备，以将计算机端口或插座灵活地重新定位到前端，使得计算机外围设备的连接变得更简单。 还公开了将计算机端口或插座灵活地重新定位到前面的装置附件。 该设备和附件也可用于灵活地固定和固定计算机系统前部的电气设备和电气部件。 组织装置可以结合到计算机或计算机外壳中。 组织装置还可以设置有电缆组织装置，其中计算机系统的接入电缆可以被组织并存储在其壳体内。