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公开(公告)号：US07050299B2
公开(公告)日：2006-05-23
申请号：US10962472
申请日：2004-10-13
申请人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
发明人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , G06F1/20 , G06F2200/201
摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.
摘要翻译： 一种可拆卸地安装在电子设备上的电子模块。 电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。 冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。
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公开(公告)号：US06807056B2
公开(公告)日：2004-10-19
申请号：US10621647
申请日：2003-07-18
申请人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
发明人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
IPC分类号： H05K720
CPC分类号： H05K7/20781 , G06F1/20 , G06F2200/201
摘要： A plurality of electronic apparatuses, each apparatus having a closed loop cooling system, are installed in a cabinet having another closed loop fluid cooling system. Each of the closed loop fluid cooling systems includes a heat receiver and a pump. A projection is mounted on the electronic apparatus and a switching valve is arranged on the cabinet to stop or start circulation of a cooling fluid.
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公开(公告)号：US20050047091A1
公开(公告)日：2005-03-03
申请号：US10791823
申请日：2004-03-04
申请人： Rintaro Minamitani , Shinji Matsushita , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Osamu Suzuki
发明人： Rintaro Minamitani , Shinji Matsushita , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Osamu Suzuki
IPC分类号： F25D17/02 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump for supplying a cooling liquid; a heat-receiving jacket, being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag, having an ion exchange resin and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag is exchangeable.
摘要翻译： 一种用于电子设备的液体冷却系统，其尺寸超薄，形状小，适合于冷却发热部件，例如具有大量发热量的半导体元件，例如维持 其耐腐蚀性长时间包括：用于供应冷却液的泵; 供给冷却液的热接收套，用于从电子部件接收热量; 散热器，供给通过热接收护套的冷却液用于辐射热; 以及用于使通过散热器的路线中的冷却液循环回到所述泵的流路，其中具有离子交换树脂的离子交换袋和其中包围的离子交换袋设置在液体的组成部分的一部分中 冷却系统和/或离子交换袋是可交换的。
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公开(公告)号：US20050047083A1
公开(公告)日：2005-03-03
申请号：US10962472
申请日：2004-10-13
申请人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
发明人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
CPC分类号： H05K7/20781 , G06F1/20 , G06F2200/201
摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.
摘要翻译： 一种可拆卸地安装在电子设备上的电子模块。 电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。 冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。
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公开(公告)号：US07296618B2
公开(公告)日：2007-11-20
申请号：US10791823
申请日：2004-03-04
申请人： Rintaro Minamitani , Shinji Matsushita , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Osamu Suzuki
发明人： Rintaro Minamitani , Shinji Matsushita , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Osamu Suzuki
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system is disclosed for use in an electronic apparatus. The system is constructed to be of a reduced size and thickness, thus allowing it to be used for cooling heat-generating devices such as semiconductor elements, while maintaining corrosion resistance. The system includes a pump, a heat-receiving jacket, and flow passages through which the cooling liquid is circulated. An ion exchange bag having a water-permeable bag is disposed within the liquid cooling system. The water-permeable bag further contains an ion exchange resin therein.
摘要翻译： 公开了一种用于电子设备的液体冷却系统。 该系统被构造为具有减小的尺寸和厚度，从而允许其用于冷却诸如半导体元件的发热装置，同时保持耐腐蚀性。 该系统包括泵，热接收夹套和冷却液循环通过的流动通道。 具有透水袋的离子交换袋设置在液体冷却系统内。 透水性袋还含有离子交换树脂。
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公开(公告)号：US06885556B2
公开(公告)日：2005-04-26
申请号：US10874232
申请日：2004-06-24
申请人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
发明人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.
摘要翻译： 一种电子设备，包括在其内部安装半导体元件的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件和用于驱动液体的液体驱动器 散热构件和受热构件之间的冷却剂。 该装置还包括储存有至少预定体积的冷却剂的液体冷却剂的罐，以限定罐内的冷却剂表面，其中罐，散热构件和受热构件与管连接， 连接到罐中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与罐的位置的变化无关。
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公开(公告)号：US20050180108A1
公开(公告)日：2005-08-18
申请号：US11108707
申请日：2005-04-19
申请人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
发明人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a case mounting a semiconductor element therein, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the case, and a liquid driver which drives a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein and having at least a predetermined volume of the coolant to delimit a coolant surface within the tank. The tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.
摘要翻译： 一种电子设备，包括：将半导体元件安装在其中的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件，以及驱动液体冷却剂 热辐射部件和受热部件。 该装置还包括在其中积聚液体冷却剂的罐，并且具有至少预定体积的冷却剂以限定罐内的冷却剂表面。 容器，散热构件和受热构件与管连接，并且连接到容器中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与位置的变化无关 坦克。
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公开(公告)号：US06757169B2
公开(公告)日：2004-06-29
申请号：US10239155
申请日：2003-05-06
申请人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
发明人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
IPC分类号： H05K720
CPC分类号： G06F1/203 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.
摘要翻译： 在具有能够稳定地循环/供给冷却液的水冷结构的电子设备或装置中，为了处理发热元件的发热增加，随着加工性能的提高，管， 其位于冷却水从构成水冷却系统的罐流出的一侧，延伸到罐的中心位置并设置在其中。 另外，设置有二（2）个板，用于将在冷却水流出的管的入口附近分配在罐内，此外，当将冷却水注入罐中时，注射夹具 因为使用冷却水，其具有与罐的连接器部分。
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公开(公告)号：US07113404B2
公开(公告)日：2006-09-26
申请号：US10791772
申请日：2004-03-04
申请人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Osamu Suzuki , Hitoshi Matsushima
发明人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Osamu Suzuki , Hitoshi Matsushima
CPC分类号： F28F9/002 , F28D1/05341 , F28F9/0246 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.
摘要翻译： 一种液体冷却系统，包括：与发热元件热连接的热接收套7，附接到散热器1a上的泵和在散热器1a上的罐部分2，其中冷却剂液体在 热接收护套7和散热器1a，从而获得用于电子设备的液体冷却系统，适用于小尺寸和薄型，同时保持其高可靠性。
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公开(公告)号：US20050088820A1
公开(公告)日：2005-04-28
申请号：US10791772
申请日：2004-03-04
申请人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Osamu Suzuki , Hitoshi Matsushima
发明人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Osamu Suzuki , Hitoshi Matsushima
CPC分类号： F28F9/002 , F28D1/05341 , F28F9/0246 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.
摘要翻译： 一种液体冷却系统，包括：与发热元件热连接的热接收套7，附接到散热器1a上的泵和在散热器1a上的罐部分2，其中冷却剂液体在 热接收护套7和散热器1a，从而获得用于电子设备的液体冷却系统，适用于小尺寸和薄型，同时保持其高可靠性。
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