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    MICROMECHANICAL DEVICE WITH A MECHANICAL STOP
    2.
    发明申请
    MICROMECHANICAL DEVICE WITH A MECHANICAL STOP 有权

    公开(公告)号：US20240425356A1

    公开(公告)日：2024-12-26

    申请号：US18645478

    申请日：2024-04-25

    Applicant: Robert Bosch GmbH

    Inventor： Jochen Reinmuth ,  Ralf Boessendoerfer ,  Robert Maul

    IPC: B81B3/00 ,  G01P15/125

    Abstract: A micromechanical device having a substrate with a main extension plane, a thin first functional layer over the substrate, and a thick second functional layer over the first functional layer. A fixed functional element and a movable functional element are formed in the second functional layer, The movable functional element is able to deflect in a first direction parallel to the main extension plane. The micromechanical device has a fixed stop element in the first functional layer, the movable functional element is also formed in the first functional layer and has a movable stop element there. The movable stop element can be applied to the fixed stop element when the movable functional element is deflected in the first direction.

    Method for manufacturing a microelectromechanical structure and microelectromechanical structure
    3.
    发明授权
    Method for manufacturing a microelectromechanical structure and microelectromechanical structure 有权

    公开(公告)号：US11975964B2

    公开(公告)日：2024-05-07

    申请号：US17446245

    申请日：2021-08-27

    Applicant: Robert Bosch GmbH

    Inventor： Jochen Reinmuth ,  Ralf Boessendoerfer

    IPC: B81C1/00

    CPC classification number: B81C1/00476 ,  B81C2201/013

    Abstract: A method for manufacturing a microelectromechanical structure. The method includes: forming a first and a second functional layer including recesses, a third functional layer, and three insulating layers situated therebetween, a structured lateral area of the third functional layer defining a movable structure, the insulating layers and the first and second functional layers each including a lateral area situated beneath the structured lateral area of the third functional layer and corresponding to a perpendicular projection of the structured lateral area; etching the insulating layers to remove the lateral area of the third insulating layer, and expose the movable structure, all recesses of the first functional layer situated in the lateral area of the first functional layer being formed by narrow trenches, the first functional layer being formed to include an electrically insulated segment in the lateral area which is separated from the remainder of the first functional layer by trenches.

    MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
    4.
    发明申请
    MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT 有权

    公开(公告)号：US20210271073A1

    公开(公告)日：2021-09-02

    申请号：US17255233

    申请日：2019-08-20

    Applicant: Robert Bosch GmbH

    Inventor： Alexander Eberspaecher ,  Frank Schatz ,  Janine Riedrich-Moeller ,  Joerg Muchow ,  Josip Mihaljevic ,  Kerrin Doessel ,  Ralf Boessendoerfer ,  Timo Schary

    IPC: G02B26/08 ,  B81B3/00 ,  B81B7/02 ,  B81C1/00

    Abstract: A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.

    METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL STRUCTURE AND MICROELECTROMENCHANICAL STRUCTURE
    6.
    发明申请
    METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL STRUCTURE AND MICROELECTROMENCHANICAL STRUCTURE 有权

    公开(公告)号：US20220081286A1

    公开(公告)日：2022-03-17

    申请号：US17446245

    申请日：2021-08-27

    Applicant: Robert Bosch GmbH

    Inventor： Jochen Reinmuth ,  Ralf Boessendoerfer

    IPC: B81C1/00

    Abstract: A method for manufacturing a microelectromechanical structure. The method includes: forming a first and a second functional layer including recesses, a third functional layer, and three insulating layers situated therebetween, a structured lateral area of the third functional layer defining a movable structure, the insulating layers and the first and second functional layers each including a lateral area situated beneath the structured lateral area of the third functional layer and corresponding to a perpendicular projection of the structured lateral area; etching the insulating layers to remove the lateral area of the third insulating layer, and expose the movable structure, all recesses of the first functional layer situated in the lateral area of the first functional layer being formed by narrow trenches, the first functional layer being formed to include an electrically insulated segment in the lateral area which is separated from the remainder of the first functional layer by trenches.

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