High density, high availability compute system

    公开(公告)号:US11044141B2

    公开(公告)日:2021-06-22

    申请号:US16506908

    申请日:2019-07-09

    摘要: A new physical computer architecture that combines elements in a virtuous cycle to eliminate performance killing inefficiencies in compute systems and need never be physically repaired during its lifetime is described. The system comprises a three dimensional rectangular cube structure with integrated liquid cooling and a multi-dimensional direct network laced through it. The network comprises a distributed, dynamically adaptive, multiply-fault-tolerant routing protocol that can logically replace failed components.

    Liquid cooled open compute project rack insert

    公开(公告)号:US10548245B2

    公开(公告)日:2020-01-28

    申请号:US15894657

    申请日:2018-02-12

    IPC分类号: H05K7/20 H05K7/14

    摘要: A system and an method to provide cooling of electronic components mounted in a tray by means of a cold plate, is disclosed. The system comprises a cold plate that is mounted in a rack with removable trays mounted on rails affixed to the underside of the cold plate. In one embodiment, compatibility with Open Rack specifications developed by the Open Compute Project is disclosed.