公开(公告)号：US20130062202A1

公开(公告)日：2013-03-14

申请号：US13670057

申请日：2012-11-06

Applicant: Roche Diagnostics Operations, Inc.

Inventor： Stefan Riebel ,  Manfred Augstein ,  Gregor Bainczyk ,  Albert Grosser ,  Oliver Kube ,  Dieter Meinecke ,  Bruno Thos ,  Herbert Wieder

IPC: G01N27/26 ,  B29C45/00

CPC classification number: G01N33/48785 ,  A61B5/14532

Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.

Abstract translation: 提供了一种用于分析测试元件上的样本的分析装置，其包括被配置为与至少一个其它部件电接触的至少一个部件，用于在它们之间进行电传输。 所述至少一个部件通常包括注射成型电路安装件，也称为MID或模制的互连装置。

公开(公告)号：US08692119B2

公开(公告)日：2014-04-08

申请号：US13670057

申请日：2012-11-06

Applicant: Roche Diagnostics Operations, Inc.

Inventor： Stefan Riebel ,  Manfred Augstein ,  Gregor Bainczyk ,  Albert Grosser ,  Oliver Kube ,  Dieter Meinecke ,  Bruno Thoes ,  Herbert Wieder

IPC: H01B5/14

CPC classification number: G01N33/48785 ,  A61B5/14532

Abstract: An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.

Abstract translation: 提供了一种用于分析测试元件上的样本的分析装置，其包括被配置为与至少一个其它部件电接触的至少一个部件，用于在它们之间进行电传输。 所述至少一个部件通常包括注射成型电路安装件，也称为MID或模制的互连装置。