公开(公告)号：US20200287114A1

公开(公告)日：2020-09-10

申请号：US16884973

申请日：2020-05-27

Applicant: Rohm Co., Ltd.

Inventor： Yosuke TAKA ,  Tomoichiro TOYAMA ,  Junichi ITAI

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/64

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.

公开(公告)号：US20190229247A1

公开(公告)日：2019-07-25

申请号：US16165798

申请日：2018-10-19

Applicant: Rohm Co., Ltd.

Inventor： Yosuke TAKA ,  Tomoichiro TOYAMA ,  Junichi ITAI

IPC: H01L33/62 ,  H01L33/56

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip (30), which has a front (30A) and a back (30B) facing opposite sides in the thickness direction z, and a first back electrode (302A) provided at the back surface (30B); a first terminal (201) in conduction with the first back electrode (302A); and a first bonding layer (311), configured to bond the first back electrode (302A) and the first terminal 201; wherein the composition of the first bonding layer (311) includes a metal eutectic composition containing Au, and when the LED chip (30) is viewed in the thickness direction z, a first bent portion (311A) which is recessed toward the inner side of the periphery of the first back electrode (302A) is formed in the first bonding layer (311).