公开(公告)号：US20180277724A1

公开(公告)日：2018-09-27

申请号：US15859845

申请日：2018-01-02

Applicant: ROHM CO., LTD.

Inventor： Hirotaka OBUCHI ,  Junichi ITAI

IPC: H01L33/56 ,  H01L33/06 ,  H01L33/12 ,  H01L33/14 ,  H01L33/32 ,  H01L33/42 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L33/06 ,  H01L33/12 ,  H01L33/145 ,  H01L33/32 ,  H01L33/42 ,  H01L33/60 ,  H01L33/62 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5246

Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicon.

公开(公告)号：US20170186930A1

公开(公告)日：2017-06-29

申请号：US15457679

申请日：2017-03-13

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/64 ,  H01L33/50 ,  H01L33/60 ,  H01L33/56 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L23/49503 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20250063876A1

公开(公告)日：2025-02-20

申请号：US18938905

申请日：2024-11-06

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/62 ,  H01L23/31 ,  H01L23/48 ,  H01L23/488 ,  H01L23/495 ,  H01L25/075 ,  H01L25/16 ,  H01L33/48 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/64

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20150091044A1

公开(公告)日：2015-04-02

申请号：US14562998

申请日：2014-12-08

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/62 ,  H01L33/54

CPC classification number: H01L23/49503 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20200287114A1

公开(公告)日：2020-09-10

申请号：US16884973

申请日：2020-05-27

Applicant: Rohm Co., Ltd.

Inventor： Yosuke TAKA ,  Tomoichiro TOYAMA ,  Junichi ITAI

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/64

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip, which has a front and a back facing opposite sides in the thickness direction z, and a first back electrode provided at the back surface; a first terminal in conduction with the first back electrode; and a first bonding layer, configured to bond the first back electrode and the first terminal 201; wherein the composition of the first bonding layer includes a metal eutectic composition containing Au, and when the LED chip is viewed in the thickness direction z, a first bent portion which is recessed toward the inner side of the periphery of the first back electrode is formed in the first bonding layer.

公开(公告)号：US20190229247A1

公开(公告)日：2019-07-25

申请号：US16165798

申请日：2018-10-19

Applicant: Rohm Co., Ltd.

Inventor： Yosuke TAKA ,  Tomoichiro TOYAMA ,  Junichi ITAI

IPC: H01L33/62 ,  H01L33/56

Abstract: The present disclosure provides a light emitting diode (LED) package, which ensures the reliability during use while adopting an LED chip of higher output. The LED package includes an LED chip (30), which has a front (30A) and a back (30B) facing opposite sides in the thickness direction z, and a first back electrode (302A) provided at the back surface (30B); a first terminal (201) in conduction with the first back electrode (302A); and a first bonding layer (311), configured to bond the first back electrode (302A) and the first terminal 201; wherein the composition of the first bonding layer (311) includes a metal eutectic composition containing Au, and when the LED chip (30) is viewed in the thickness direction z, a first bent portion (311A) which is recessed toward the inner side of the periphery of the first back electrode (302A) is formed in the first bonding layer (311).

公开(公告)号：US20190157526A1

公开(公告)日：2019-05-23

申请号：US16260933

申请日：2019-01-29

Applicant: ROHM CO., LTD.

Inventor： Hirotaka OBUCHI ,  Junichi ITAI

IPC: H01L33/56 ,  H01L33/14 ,  H01L33/60 ,  H01L33/42 ,  H01L33/32 ,  H01L33/62 ,  H01L33/06 ,  H01L33/12

CPC classification number: H01L33/56 ,  H01L33/06 ,  H01L33/12 ,  H01L33/145 ,  H01L33/32 ,  H01L33/42 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5246

Abstract: A semiconductor light emitting device includes a substrate made of resin, a first wiring and a second wiring formed on the substrate, a light emitting element disposed on the substrate and electrically connected to the first wiring and the second wiring, and a transparent sealing resin configured to seal the light emitting element. The substrate contains an acrylic resin, and the sealing resin contains silicone.

公开(公告)号：US20230411581A1

公开(公告)日：2023-12-21

申请号：US18459763

申请日：2023-09-01

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/62 ,  H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L23/49541 ,  H01L23/4951 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L23/49575 ,  H01L23/49517 ,  H01L33/52 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/64 ,  H01L23/49568 ,  H01L33/483 ,  H01L33/54 ,  H01L23/48 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49548 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L25/167

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20220384699A1

公开(公告)日：2022-12-01

申请号：US17885181

申请日：2022-08-10

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L33/62 ,  H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

公开(公告)号：US20210057312A1

公开(公告)日：2021-02-25

申请号：US17091690

申请日：2020-11-06

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Kazuhiro MIREBA ,  Shintaro YASUDA ,  Junichi ITAI ,  Taisuke OKADA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/488 ,  H01L33/48 ,  H01L33/52 ,  H01L25/075 ,  H01L33/64 ,  H01L33/62 ,  H01L33/54 ,  H01L23/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.