SYSTEM AND A METHOD FOR SOLDER MASK INSPECTION
    3.
    发明申请
    SYSTEM AND A METHOD FOR SOLDER MASK INSPECTION 有权
    系统和焊接掩模检查方法

    公开(公告)号:US20130177698A1

    公开(公告)日:2013-07-11

    申请号:US13545014

    申请日:2012-07-10

    IPC分类号: H05K3/22

    摘要: A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect.

    摘要翻译: 一种用于检查辅助印刷的系统和方法,所述方法可以包括在印刷过程中由系统的印刷单元在基板的区域上印刷图案; 由系统的检查单位检查提供检验结果的地区; 基于检查结果,由系统的处理器搜索缺陷; 并且其中如果发现缺陷 - 确定是否(a)修复所述基板,(b)执行改进所述印刷过程的校正措施,或(c)不执行所述缺陷的校正措施。