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公开(公告)号:US11984693B2
公开(公告)日:2024-05-14
申请号:US16975854
申请日:2019-02-04
CPC分类号: H01R43/007 , H01R13/2414 , H01R43/16 , H01R12/714 , H01R13/035 , H01R24/50 , H01R2201/20 , Y10T29/49204
摘要: A method, comprising: forming a dielectric structure, the structure comprising a first terminal surface, a second terminal surface and a through-hole that extends from the first terminal surface to the second terminal surface, applying an electrically conductive material to at least a portion of the dielectric structure, removing a first portion of the electrically conductive material from the first terminal surface, and removing a second portion of the electrically conductive material from the second terminal surface, a remaining portion of the electrically conductive material constituting at least an inner conductor of a first generally coaxial conductor pair and a first shielding conductor of the first generally coaxial conductor pair, and the inner conductor extending through the through-hole.