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1.发明申请公开(公告)号：US20090143511A1
公开(公告)日：2009-06-04
申请号：US11572162
申请日：2005-07-12
CPC分类号： C08L63/00 , C08G59/621 , C08K3/22 , C08K5/523 , H01L23/295 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) has a [101]/[001] peak intensity ratio of 0.9 or more as determined by X-ray diffraction, a BET specific surface area of 1 to 4 m2/g, and an average particle diameter of 5 μm or less, and provides an encapsulated epoxy-resin molding compound superior in flame resistance moldability and also in reliability such as reflow resistance, moisture resistance, high-temperature storage stability, and thus, favorable for sealing VLSI, and an electronic component device carrying an element sealed with the molding compound.
摘要翻译： 本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂模塑料，其中氢氧化钙（C）具有[101] / [001 ]峰强度比为0.9以上，通过X射线衍射测定，BET比表面积为1〜4m 2 / g，平均粒径为5μm以下，并且提供了包封的环氧树脂模塑料 耐燃性成型性以及耐回流性，耐湿性，高温保存稳定性等的可靠性，有利于密封VLSI的电子部件装置以及携带用模塑料密封的元件的电子部件装置。
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2.发明申请公开(公告)号：US20080039556A1
公开(公告)日：2008-02-14
申请号：US11572155
申请日：2005-07-12
CPC分类号： C08L63/00 , C08G59/1483 , C08G59/621 , C08K9/02
摘要： The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) contains magnesium hydroxide coated with silica, and provides a non-halogenated and non-antimony encapsulated epoxy-resin molding compound superior in flame resistance moldability and also in reliability such as reflow resistance, moisture resistance, high-temperature storage stability, and thus, favorable for sealing VLSI, and an electronic component device carrying an element sealed with the molding compound.
摘要翻译： 本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂模塑料，其中氢氧化镁（C）含有用二氧化硅涂覆的氢氧化镁，以及 提供了耐火成型性优异的非卤化和非锑封装的环氧树脂模塑料，以及耐回流性，耐湿性，高温储存稳定性等可靠性，因此有利于密封VLSI，电子部件 携带用模塑料密封的元件的装置。
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公开(公告)号：US20090137717A1
公开(公告)日：2009-05-28
申请号：US11995372
申请日：2006-07-13
IPC分类号： C08K3/22
CPC分类号： C08L63/00 , C08K3/22 , H01L23/293 , H01L23/295 , H01L2924/0002 , H01L2924/09701 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： The present invention relates to an encapsulated epoxy resin composition containing an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), the magnesium hydroxide (C) comprising magnesium hydroxide particles with its crystal appearance in a hexagonal column shape having two hexagonal top and bottom base faces in parallel with each other and six peripheral prism faces formed between the base faces and having a length in the c-axis direction of 1.5×10−6 to 6.0×10−6 m, and provides an encapsulated epoxy resin composition favorable as a sealer for VLSI's that is superior in flame resistance and also in reliability such as moldability, reflow resistance, moisture resistance and high temperature storage characteristics and an electronic component device containing an element sealed with the composition.
摘要翻译： 本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂组合物，所述氢氧化镁（C）包含氢氧化镁颗粒，其晶体外观为六方柱 具有彼此平行的两个六边形顶部和底部基面的形状，以及形成在基面之间并且在c轴方向上的长度为1.5×10 -6至6.0×10 -6 m的六个圆周棱镜面，并且提供了封装 环氧树脂组合物作为具有优异的阻燃性以及成型性，耐回流性，耐湿性和高温储存特性等可靠性的VLSI的密封剂，以及包含用该组合物密封的元素的电子部件装置。
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