公开(公告)号：US11660702B2

公开(公告)日：2023-05-30

申请号：US16249533

申请日：2019-01-16

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Kyongho Hong ,  Dokyun Kwon ,  Seokjoo Lee ,  Jeongho Yi

IPC: B23K26/142 ,  B08B5/04 ,  B08B15/04

CPC classification number: B23K26/142 ,  B08B5/04 ,  B08B15/04

Abstract: A laser apparatus including a stage. A target substrate is mounted on the stage. The laser apparatus further includes a coupling unit disposed below the stage and coupled with a conveying unit, the conveying unit conveying the stage. The laser apparatus additionally includes a discharge unit disposed at a predetermined position for laser machining, configured to communicate with the coupling unit when docked with the coupling unit, and configured to discharge foreign matter that is generated during laser machining.

公开(公告)号：US11819941B2

公开(公告)日：2023-11-21

申请号：US16384458

申请日：2019-04-15

Applicant: SAMSUNG DISPLAY CO., LTD

Inventor： Jinwon Baek ,  Seokjoo Lee ,  Sangsun Han ,  Kyongho Hong

IPC: B23K26/06 ,  G02B13/00 ,  G02B19/00 ,  B23K26/082 ,  G02B26/10 ,  B23K26/70

CPC classification number: B23K26/0821 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/702 ,  G02B13/0005 ,  G02B19/0009 ,  G02B19/0047 ,  G02B26/105

Abstract: A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.

公开(公告)号：US20200086423A1

公开(公告)日：2020-03-19

申请号：US16384458

申请日：2019-04-15

Applicant: SAMSUNG DISPLAY CO., LTD

Inventor： Jinwon Baek ,  Seokjoo Lee ,  Sangsun Han ,  Kyongho Hong

IPC: B23K26/082 ,  G02B26/10 ,  G02B19/00 ,  G02B13/00 ,  B23K26/06 ,  B23K26/70

Abstract: A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.