SUBSTRATE PEELING APPARATUS AND METHOD OF PEELING SUBSTRATE USING THE SAME
    1.
    发明申请
    SUBSTRATE PEELING APPARATUS AND METHOD OF PEELING SUBSTRATE USING THE SAME 有权
    基板剥离装置和使用该基板的基板剥离方法

    公开(公告)号:US20150217557A1

    公开(公告)日:2015-08-06

    申请号:US14474710

    申请日:2014-09-02

    Abstract: A substrate peeling apparatus includes a support member and absorption pads. The support member, having a quadrangular shape, includes first and second vertexes diagonally facing each other in a first direction, and third and fourth vertexes diagonally facing each other in a second direction crossing the first direction. The absorption pads is disposed on the support member. The absorption pads are arranged in rows in a direction parallel to the first direction and at least one absorption pad of each row is arranged in a direction parallel to the second direction. An absorption pad of each row includes a hole having an increasing internal diameter as a distance in the first direction between the each row and the first vertex increases. An internal diameter of an absorption pad in a row positioned halfway between the first and second vertexes has a maximum internal diameter.

    Abstract translation: 基板剥离装置包括支撑构件和吸收垫。 具有四边形形状的支撑构件包括在第一方向上彼此对角地相对的第一和第二顶点以及与第一方向交叉的第二方向彼此相对的第三和第四顶点。 吸收垫设置在支撑构件上。 吸收垫沿着与第一方向平行的方向排成行,并且每行的至少一个吸收垫沿与第二方向平行的方向排列。 每行的吸收垫包括具有增加的内径的孔,其中在每行之间的第一方向上的距离与第一顶点之间增加。 位于第一和第二顶点之间的行中的吸收垫的内径具有最大内径。

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