公开(公告)号：US09731492B2

公开(公告)日：2017-08-15

申请号：US14474710

申请日：2014-09-02

Applicant: SAMSUNG DISPLAY CO., LTD. ,  TOPTEC CO., LTD

Inventor： Kwangho Lee ,  Youngbae Kim ,  Sangil Kim ,  Jongseong Kim ,  Hyeokyun Kwon

IPC: B32B43/00 ,  B32B38/10

CPC classification number: B32B43/006 ,  B32B2309/06 ,  B32B2457/20 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/19 ,  Y10T156/1944 ,  Y10T156/1978

Abstract: A substrate peeling apparatus includes a support member and absorption pads. The support member, having a quadrangular shape, includes first and second vertexes diagonally facing each other in a first direction, and third and fourth vertexes diagonally facing each other in a second direction crossing the first direction. The absorption pads is disposed on the support member. The absorption pads are arranged in rows in a direction parallel to the first direction and at least one absorption pad of each row is arranged in a direction parallel to the second direction. An absorption pad of each row includes a hole having an increasing internal diameter as a distance in the first direction between the each row and the first vertex increases. An internal diameter of an absorption pad in a row positioned halfway between the first and second vertexes has a maximum internal diameter.

公开(公告)号：US20150138494A1

公开(公告)日：2015-05-21

申请号：US14300397

申请日：2014-06-10

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： TaeHwan KIM ,  Myeonghee Kim ,  Youngbae Kim ,  Jong Seong Kim ,  Myunghwan Park ,  Jonghwan Lee

IPC: G02F1/1333 ,  H01L21/768 ,  G02F1/1339 ,  H01L27/12

CPC classification number: G02F1/133305 ,  G02F2202/22 ,  H01L21/02038 ,  H01L21/02172 ,  H01L21/02296 ,  H01L27/124 ,  H01L27/1262 ,  H01L27/1266

Abstract: The method of manufacturing a device substrate includes forming a surface modifying layer on a process substrate. The surface modifying layer has a different hydrophobicity from that of the process substrate. The process substrate is disposed on a carrier substrate. The surface modifying layer is disposed between the process substrate and the carrier substrate. A device is formed on the process substrate. The process substrate is separated from the carrier substrate.

Abstract translation: 制造器件衬底的方法包括在处理衬底上形成表面改性层。 表面改性层具有与处理基材不同的疏水性。 处理基板设置在载体基板上。 表面改性层设置在处理基板和载体基板之间。 在处理基板上形成器件。 将工艺衬底与载体衬底分离。

公开(公告)号：US09500890B2

公开(公告)日：2016-11-22

申请号：US14300397

申请日：2014-06-10

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： TaeHwan Kim ,  Myeonghee Kim ,  Youngbae Kim ,  Jong Seong Kim ,  Myunghwan Park ,  Jonghwan Lee

IPC: H01L21/02 ,  G02F1/1333 ,  H01L27/12

CPC classification number: G02F1/133305 ,  G02F2202/22 ,  H01L21/02038 ,  H01L21/02172 ,  H01L21/02296 ,  H01L27/124 ,  H01L27/1262 ,  H01L27/1266

Abstract: The method of manufacturing a device substrate includes forming a surface modifying layer on a process substrate. The surface modifying layer has a different hydrophobicity from that of the process substrate. The process substrate is disposed on a carrier substrate. The surface modifying layer is disposed between the process substrate and the carrier substrate. A device is formed on the process substrate. The process substrate is separated from the carrier substrate.

Abstract translation: 制造器件衬底的方法包括在处理衬底上形成表面改性层。 表面改性层具有与处理基材不同的疏水性。 处理基板设置在载体基板上。 表面改性层设置在处理基板和载体基板之间。 在处理基板上形成器件。 将工艺衬底与载体衬底分离。