公开(公告)号：US20210175016A1

公开(公告)日：2021-06-10

申请号：US16867706

申请日：2020-05-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Duk YUN ,  Seonyoung YOO ,  Byeongguk CHOI ,  Young Hoon SONG ,  Yuseop LEE ,  A Ra CHO ,  Dong Hwi SHIN

IPC: H01G4/232

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, and including first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, the first and second external electrodes include first and second base electrodes including a first conductive metal and reactive glass, in contact with the ceramic body, and first and second conductive layers including and a second conductive metal, disposed on the first and second base electrodes, and a nanostructure may be disposed on surfaces of the first and second conductive layers.

公开(公告)号：US20240212940A1

公开(公告)日：2024-06-27

申请号：US18384796

申请日：2023-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho In JUN ,  Byung Jun JEON ,  Yong Won SEO ,  Chae Min PARK ,  Hyung Duk YUN ,  A Ra CHO

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/12

Abstract: A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 μm×5 μm region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 μm or greater.

公开(公告)号：US20210217561A1

公开(公告)日：2021-07-15

申请号：US17060374

申请日：2020-10-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Duk YUN ,  Seonyoung YOO ,  Hong Gi KIM ,  Byeongguk CHOI ,  Young Hoon SONG ,  Yuseop LEE ,  A Ra CHO ,  Donghwi SHIN

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12

Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, and a capacitance forming portion disposed in such a manner that first and second internal electrodes are stacked with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the ceramic body, respectively, the first and second external electrodes including first and second base electrodes connected to the first and second internal electrodes, respectively, and first and second conductive layers disposed to cover the first and second base electrodes, respectively. The first and second conductive layers have a thickness in a range of 0.1 μm to 10 μm.