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    MULTILAYERED CERAMIC CAPACITOR
    4.
    发明公开
    MULTILAYERED CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20240331940A1

    公开(公告)日：2024-10-03

    申请号：US18583248

    申请日：2024-02-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chae Min PARK ,  Yong-Won Seo ,  Youngjun Cha ,  Seonho Kim

    IPC: H01G4/008 ,  H01G4/12 ,  H01G4/30

    CPC classification number: H01G4/008 ,  H01G4/1209 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor may include: a ceramic body that includes dielectric layers and internal electrodes; an external electrode including a connection portion that covers an end surface of the ceramic body and a band portion that extends from the connection portion to cover a side surface of the ceramic body; a first cover layer disposed between the internal electrode closest to the side surface and the side surface; a second cover layer opposing the first cover layer; an active region in which the internal electrodes overlap and spaced apart from the end surface by a first distance, a first dummy electrode disposed in the first cover layer, and a seed electrode layer disposed between the band portion and the first cover layer, wherein a length of the seed electrode layer is greater than the first distance and greater than a length of the first dummy electrode.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210090807A1

    公开(公告)日：2021-03-25

    申请号：US16838592

    申请日：2020-04-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Hee JEONG ,  Min Hyang KIM ,  Dong Yeong KIM ,  Chae Min PARK

    IPC: H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H01G4/12

    Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is a, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is b, b/a is 0.07 or more.

    MULTILAYER ELECTRONIC COMPONENT
    8.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240212940A1

    公开(公告)日：2024-06-27

    申请号：US18384796

    申请日：2023-10-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho In JUN ,  Byung Jun JEON ,  Yong Won SEO ,  Chae Min PARK ,  Hyung Duk YUN ,  A Ra CHO

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/12

    Abstract: A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 μm×5 μm region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 μm or greater.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    9.
    发明公开
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230326678A1

    公开(公告)日：2023-10-12

    申请号：US18209255

    申请日：2023-06-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Hee JEONG ,  Min Hyang KIM ,  Dong Yeong KIM ,  Chae Min PARK

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/248

    CPC classification number: H01G4/30 ,  H01G4/1227 ,  H01G4/012 ,  H01G4/248

    Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is a, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is b, b/a is 0.07 or more.

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