公开(公告)号：US20170135196A1

公开(公告)日：2017-05-11

申请号：US15183116

申请日：2016-06-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Seong KIM ,  Eun Sang NA ,  Chul Soon AHN

IPC: H05K1/02 ,  H05K1/03 ,  H05K7/20

CPC classification number: H05K7/2039 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/4602 ,  H05K2201/10416

Abstract: A heat dissipation member includes a body formed of a metal; and an epoxy resin layer formed on a surface of the body and having insulating properties. A printed circuit board includes a heat dissipation member embedded in the printed circuit board, the heat dissipation member including a body formed of a metal and an epoxy resin layer formed on a surface of the body and having insulating properties, and an insulator formed to surround the heat dissipation member.