公开(公告)号：US20220208452A1

公开(公告)日：2022-06-30

申请号：US17512063

申请日：2021-10-27

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Jin Bok SHIN ,  Yu Ra SHIN ,  Seung Yong LEE ,  Jung Hyun AN ,  Yong Hwa LEE ,  Da Hyeon GO ,  Choong Seop JEON ,  Min Soo KIM

IPC分类号： H01G4/12 ,  H01G4/30

摘要： A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.