公开(公告)号：US20190341192A1

公开(公告)日：2019-11-07

申请号：US16516612

申请日：2019-07-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Ra SHIN ,  Myeong Gi KIM ,  Eung Soo KIM ,  Hak Kwan KIM ,  Jang Yeol LEE ,  Seong Min CHIN

IPC: H01G4/30 ,  C04B35/634 ,  C04B35/468 ,  H01G4/12 ,  H01G4/008 ,  C08K3/04

Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.

公开(公告)号：US20180174756A1

公开(公告)日：2018-06-21

申请号：US15675102

申请日：2017-08-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Ra SHIN ,  Myeong Gi KIM ,  Eung Soo KIM ,  Hak Kwan KIM ,  Jang Yeol LEE ,  Seong Min CHIN

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008 ,  C08K3/04 ,  C04B35/468

CPC classification number: H01G4/30 ,  C04B35/4682 ,  C04B35/63424 ,  C04B2235/3236 ,  C04B2235/422 ,  C04B2235/425 ,  C04B2235/48 ,  C04B2235/528 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/721 ,  C08K3/042 ,  H01G4/008 ,  H01G4/1218 ,  C08L33/10

Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.

公开(公告)号：US20180144863A1

公开(公告)日：2018-05-24

申请号：US15448523

申请日：2017-03-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myeong Gi KIM ,  Yu Ra SHIN ,  Jang Yeol LEE ,  Seong Min CHIN ,  Hak Kwan KIM

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248

CPC classification number: H01G4/008 ,  C01B32/182 ,  C01B32/23 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.

公开(公告)号：US20220208452A1

公开(公告)日：2022-06-30

申请号：US17512063

申请日：2021-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Bok SHIN ,  Yu Ra SHIN ,  Seung Yong LEE ,  Jung Hyun AN ,  Yong Hwa LEE ,  Da Hyeon GO ,  Choong Seop JEON ,  Min Soo KIM

IPC: H01G4/12 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.

公开(公告)号：US20190333699A1

公开(公告)日：2019-10-31

申请号：US16177093

申请日：2018-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Yong LEE ,  Yu Ra SHIN ,  Hak Kwan KIM ,  Jin Bok SHIN ,  Myung Joo LEE

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008 ,  C01B32/182

Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.

公开(公告)号：US20230147982A1

公开(公告)日：2023-05-11

申请号：US17686951

申请日：2022-03-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Soo KIM ,  Jung Hyun AN ,  Yun KIM ,  Seung Yong LEE ,  Dong Chan SEO ,  Yu Ra SHIN ,  Jin Bok SHIN ,  Choong Seop JEON ,  Yun Jeong CHA

IPC: H01G4/12 ,  H01G4/232 ,  C04B35/468 ,  C04B35/628 ,  C04B35/64 ,  C04B37/00

CPC classification number: H01G4/1227 ,  C04B35/64 ,  C04B35/4682 ,  C04B35/62815 ,  C04B37/003 ,  H01G4/2325 ,  C04B2235/3224 ,  C04B2235/3236 ,  C04B2237/346

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The dielectric layer includes dielectric grains, at least a portion of the dielectric grains has a core-shell structure, and a shell of the core-shell structure contains a rare earth element having an average concentration of more than 0.5 at%.

公开(公告)号：US20240258031A1

公开(公告)日：2024-08-01

申请号：US18632624

申请日：2024-04-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Bok SHIN ,  Yu Ra SHIN ,  Seung Yong LEE ,  Jung Hyun AN ,  Yong Hwa LEE ,  Da Hyeon GO ,  Choong Seop JEON ,  Min Soo KIM

IPC: H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/1209 ,  H01G4/30 ,  H01G4/012 ,  H01G4/232

Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.

公开(公告)号：US20190228909A1

公开(公告)日：2019-07-25

申请号：US16372777

申请日：2019-04-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myeong Gi KIM ,  Yu Ra SHIN ,  Jang Yeol LEE ,  Seong MIN ,  Hak Kwan KIM

IPC: H01G4/008 ,  H01G4/30 ,  C01B32/23 ,  H01G4/12 ,  H01G4/248 ,  C01B32/182

Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.