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公开(公告)号：US20220208452A1
公开(公告)日：2022-06-30
申请号：US17512063
申请日：2021-10-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Bok SHIN , Yu Ra SHIN , Seung Yong LEE , Jung Hyun AN , Yong Hwa LEE , Da Hyeon GO , Choong Seop JEON , Min Soo KIM
Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.
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公开(公告)号：US20250166922A1
公开(公告)日：2025-05-22
申请号：US18795951
申请日：2024-08-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyo Sung CHOI , Jung Jin PARK , Ho Sam CHOI , Dae Jin SHIM , Seung Yong LEE , Yong Hwa LEE , Jong Ho LEE
Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction; and an external electrode disposed on the body. The cover portion may include barium (Ba), gallium (Ga), and tin (Sn), and a ratio (A/B) of the number of moles (A) of gallium (Ga) to 100 moles of barium (Ba) included in the cover portion to the number of moles (B) of tin (Sn) compared to 100 moles of barium (Ba) included in the cover portion may satisfy 0.2≤A/B≤4.0.
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公开(公告)号：US20250157743A1
公开(公告)日：2025-05-15
申请号：US18921252
申请日：2024-10-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Jin PARK , Ho Sam CHOI , Dae Jin SHIM , Hyo Sung CHOI , Seung Yong LEE , Yong Hwa LEE , Jin Bok SHIN , Hyo Sub KIM , Dong Jun JUNG , Jong Ho LEE
Abstract: A multilayer electronic component includes: a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on upper and bottom surfaces of the capacitance formation portion in the first direction; and an external electrode disposed on the body, and the cover portion may include titanium (Ti), gallium (Ga), and phosphorus (P), and a molar amount of gallium (Ga) with respect to 100 moles of titanium (Ti) included in the cover portion may be 0.3 moles or more and 6.0 moles or less.
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公开(公告)号：US20240258031A1
公开(公告)日：2024-08-01
申请号：US18632624
申请日：2024-04-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Bok SHIN , Yu Ra SHIN , Seung Yong LEE , Jung Hyun AN , Yong Hwa LEE , Da Hyeon GO , Choong Seop JEON , Min Soo KIM
CPC classification number: H01G4/1209 , H01G4/30 , H01G4/012 , H01G4/232
Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.
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