公开(公告)号：US20240203648A1

公开(公告)日：2024-06-20

申请号：US18134727

申请日：2023-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Bok SHIN ,  Min Soo KIM ,  Choong Seop JEON ,  Jung Hyun AN ,  Seung Yong LEE

IPC: H01G4/12 ,  H01G4/30

CPC classification number: H01G4/1209 ,  H01G4/30

Abstract: A multilayer electronic includes a body including a permeation layer disposed inside the body and in contact with a surface of the body, a dielectric layer, and internal electrodes and external electrodes disposed on the body, wherein an average content of subcomponent element included in the permeation layer is higher than an average content of subcomponent elements included in the dielectric layer, and an average surface roughness of the body is 0.01 nm or more and 40 nm or less.

公开(公告)号：US20230147982A1

公开(公告)日：2023-05-11

申请号：US17686951

申请日：2022-03-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Soo KIM ,  Jung Hyun AN ,  Yun KIM ,  Seung Yong LEE ,  Dong Chan SEO ,  Yu Ra SHIN ,  Jin Bok SHIN ,  Choong Seop JEON ,  Yun Jeong CHA

IPC: H01G4/12 ,  H01G4/232 ,  C04B35/468 ,  C04B35/628 ,  C04B35/64 ,  C04B37/00

CPC classification number: H01G4/1227 ,  C04B35/64 ,  C04B35/4682 ,  C04B35/62815 ,  C04B37/003 ,  H01G4/2325 ,  C04B2235/3224 ,  C04B2235/3236 ,  C04B2237/346

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The dielectric layer includes dielectric grains, at least a portion of the dielectric grains has a core-shell structure, and a shell of the core-shell structure contains a rare earth element having an average concentration of more than 0.5 at%.

公开(公告)号：US20220208452A1

公开(公告)日：2022-06-30

申请号：US17512063

申请日：2021-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Bok SHIN ,  Yu Ra SHIN ,  Seung Yong LEE ,  Jung Hyun AN ,  Yong Hwa LEE ,  Da Hyeon GO ,  Choong Seop JEON ,  Min Soo KIM

IPC: H01G4/12 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.

公开(公告)号：US20190333699A1

公开(公告)日：2019-10-31

申请号：US16177093

申请日：2018-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Yong LEE ,  Yu Ra SHIN ,  Hak Kwan KIM ,  Jin Bok SHIN ,  Myung Joo LEE

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008 ,  C01B32/182

Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.

公开(公告)号：US20250157743A1

公开(公告)日：2025-05-15

申请号：US18921252

申请日：2024-10-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Jin PARK ,  Ho Sam CHOI ,  Dae Jin SHIM ,  Hyo Sung CHOI ,  Seung Yong LEE ,  Yong Hwa LEE ,  Jin Bok SHIN ,  Hyo Sub KIM ,  Dong Jun JUNG ,  Jong Ho LEE

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

Abstract: A multilayer electronic component includes: a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on upper and bottom surfaces of the capacitance formation portion in the first direction; and an external electrode disposed on the body, and the cover portion may include titanium (Ti), gallium (Ga), and phosphorus (P), and a molar amount of gallium (Ga) with respect to 100 moles of titanium (Ti) included in the cover portion may be 0.3 moles or more and 6.0 moles or less.

公开(公告)号：US20240258031A1

公开(公告)日：2024-08-01

申请号：US18632624

申请日：2024-04-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Bok SHIN ,  Yu Ra SHIN ,  Seung Yong LEE ,  Jung Hyun AN ,  Yong Hwa LEE ,  Da Hyeon GO ,  Choong Seop JEON ,  Min Soo KIM

IPC: H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/1209 ,  H01G4/30 ,  H01G4/012 ,  H01G4/232

Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.