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公开(公告)号:US20220208452A1
公开(公告)日:2022-06-30
申请号:US17512063
申请日:2021-10-27
发明人: Jin Bok SHIN , Yu Ra SHIN , Seung Yong LEE , Jung Hyun AN , Yong Hwa LEE , Da Hyeon GO , Choong Seop JEON , Min Soo KIM
摘要: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.
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公开(公告)号:US20190333699A1
公开(公告)日:2019-10-31
申请号:US16177093
申请日:2018-10-31
发明人: Seung Yong LEE , Yu Ra SHIN , Hak Kwan KIM , Jin Bok SHIN , Myung Joo LEE
IPC分类号: H01G4/30 , H01G4/12 , H01G4/008 , C01B32/182
摘要: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.
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