公开(公告)号：US20250126707A1

公开(公告)日：2025-04-17

申请号：US18829690

申请日：2024-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Won HAN ,  Sang Ho JEONG ,  Chang Hwa PARK ,  Hyun Hu LEE ,  Deok Hong JO ,  Jong Eun PARK

IPC: H05K1/02 ,  H05K1/09

Abstract: A printed circuit board includes an insulating layer and a wiring pattern disposed on or within the insulating layer, wherein the wiring pattern includes a first metal layer, a second metal layer disposed on an upper surface of the first metal layer, and an inorganic oxide film disposed on a side surface of the second metal layer.

公开(公告)号：US20250107008A1

公开(公告)日：2025-03-27

申请号：US18783666

申请日：2024-07-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Hu LEE ,  Jong Eun PARK ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Sang Won HAN ,  Deok Hong JO

IPC: H05K3/40 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34

Abstract: A printed circuit board includes a wiring portion including one or more insulating layers, one or more wiring layers respectively disposed on or in the one or more insulating layers, a first pad disposed on a lowermost insulating layer, of the one or more insulating layers, and a second pad disposed on an uppermost insulating layer, of the one or more insulating layers, a first solder resist layer disposed on a lower side of the wiring portion to cover at least a portion of the first pad, the first solder resist layer having a first opening, on the first pad, a second solder resist layer disposed on an upper side of the wiring portion to cover at least a portion of the second pad, a first surface treatment layer disposed on at least a portion of the first pad, and a barrier layer disposed on the first solder resist layer.