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公开(公告)号：US20240365467A1
公开(公告)日：2024-10-31
申请号：US18407677
申请日：2024-01-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Jong Eun PARK
CPC classification number: H05K1/0306 , H05K1/0298 , H05K1/036 , H05K1/115 , H05K3/46 , H05K2201/096 , H05K2201/09827
Abstract: The present disclosure relates to a printed circuit board include: a core layer including an inorganic insulating layer, a resin layer covering at least a portion of an external side surface of the inorganic insulating layer, and a second insulating layer covering at least a portion of a lower surface of each of the inorganic insulating layer and the resin layer and having an interlayer boundary with the resin layer; a first wiring layer disposed on an upper surface of the core layer; and a second wiring layer disposed on a lower surface of the core layer. The external side surface of the inorganic insulating layer is substantially perpendicular to at least one of the upper surface and the lower surface of the inorganic insulating, and a manufacturing method therefor.
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公开(公告)号：US20240164013A1
公开(公告)日：2024-05-16
申请号：US18221001
申请日：2023-07-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Heun LEE , Jong Eun PARK , Chan Jin PARK , Hyun Seok YANG , Tae Hee YOO
CPC classification number: H05K1/0298 , H05K3/181 , H05K3/26
Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.
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公开(公告)号：US20250056727A1
公开(公告)日：2025-02-13
申请号：US18632794
申请日：2024-04-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Ho JEONG , Jong Eun PARK , Chang Hwa PARK , Hyun Hu LEE
Abstract: The present disclosure relates to a printed circuit board, including: a plurality of insulating layers having a through-portion; a plurality of wiring layers respectively disposed on or in the plurality of insulating layers; a plurality of via layers respectively penetrating through at least a portion of at least one of the plurality of insulating layers and respectively connected to at least one of the plurality of wiring layers; an electronic component at least partially disposed in the through-portion, and embedded in at least one of the plurality of insulating layers; and an insulating film disposed in the plurality of insulating layers, and covering at least a portion of a side surface of the electronic component and at least a portion of a wall surface of the through-portion.
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公开(公告)号：US20240155212A1
公开(公告)日：2024-05-09
申请号：US18318273
申请日：2023-05-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Do Hwan KIM , Ju Ho KIM , Sang Hyun JI , Jung Hyun PARK , Nam Keun OH , Doo Seub SHIN , Dong Hoon LEE , Jong Eun PARK , Sangik CHO
Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.
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公开(公告)号：US20240431023A1
公开(公告)日：2024-12-26
申请号：US18588905
申请日：2024-02-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Ho JEONG , Jong Eun PARK , Chang Hwa PARK , Hyun Hu LEE
Abstract: A printed circuit board includes a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a cavity; and a first barrier layer having at least a portion disposed between the first and second insulating layers and in contact with a side surface of at least a portion of the first wiring layer.
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Patent Agency Ranking
公开(公告)号：US20250081338A1
公开(公告)日：2025-03-06
申请号：US18769762
申请日：2024-07-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Ho JEONG , Jong Eun PARK , Chang Hwa PARK , Hyun Hu LEE
Abstract: A printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. In a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.
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公开(公告)号：US20250016921A1
公开(公告)日：2025-01-09
申请号：US18629159
申请日：2024-04-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Ho JEONG , Jong Eun PARK , Chang Hwa PARK , Hyun Hu LEE
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer disposed on an upper side of the first insulating layer, a second metal layer disposed on a lower side of the first insulating layer, and a first via layer penetrating through at least a portion of the first insulating layer to connect the first metal layer to the second metal layer. The first via layer has a tapered shape becoming narrower toward a top of the first insulating layer, and an upper surface of the first metal layer is substantially flat, and a side surface of the first metal layer has a curved surface.
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公开(公告)号：US20240224420A1
公开(公告)日：2024-07-04
申请号：US18212867
申请日：2023-06-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyun Woo KWON , Jong Eun PARK
CPC classification number: H05K1/0298 , H05K1/111 , H05K1/115 , H05K3/4602
Abstract: A printed circuit board includes a first substrate portion including a first insulating layer, a second insulating layer disposed on the first insulating layer, and a third insulating layer disposed on the second insulating layer; and a second substrate portion disposed on the first substrate portion and including a first fine insulating layer as a build-up insulating layer on an uppermost side of the first substrate portion and the second substrate portion. A thickness of the first insulating layer, a thickness of the second insulating layer, and a thickness of the third insulating layer are sequentially reduced. A thickness of the first fine insulating layer is lower than the thickness of the third insulating layer.
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公开(公告)号：US20240196528A1
公开(公告)日：2024-06-13
申请号：US18138893
申请日：2023-04-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sangik CHO , Mi Jung PARK , Mi Geum KIM , Yong Su LEE , Sung HAN , Jong Eun PARK
Abstract: A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.
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公开(公告)号：US20240186059A1
公开(公告)日：2024-06-06
申请号：US18207372
申请日：2023-06-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Mi Geum KIM , Jong Eun PARK , Sang Ik CHO , Mi Jung PARK , Yong Su LEE
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/324 , H01F2017/002 , H01F2017/048
Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a first direction, a support member disposed in the body, the support member having a first surface and a second surface opposing each other, a coil disposed on the support member, a pad portion disposed on the first surface of the support member to be connected to the coil, an external electrode disposed on the first surface of the body, and a via electrode connecting the pad portion and the external electrode to each other.
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