公开(公告)号：US20250056727A1

公开(公告)日：2025-02-13

申请号：US18632794

申请日：2024-04-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Ho JEONG ,  Jong Eun PARK ,  Chang Hwa PARK ,  Hyun Hu LEE

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

Abstract: The present disclosure relates to a printed circuit board, including: a plurality of insulating layers having a through-portion; a plurality of wiring layers respectively disposed on or in the plurality of insulating layers; a plurality of via layers respectively penetrating through at least a portion of at least one of the plurality of insulating layers and respectively connected to at least one of the plurality of wiring layers; an electronic component at least partially disposed in the through-portion, and embedded in at least one of the plurality of insulating layers; and an insulating film disposed in the plurality of insulating layers, and covering at least a portion of a side surface of the electronic component and at least a portion of a wall surface of the through-portion.

公开(公告)号：US20240431023A1

公开(公告)日：2024-12-26

申请号：US18588905

申请日：2024-02-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Ho JEONG ,  Jong Eun PARK ,  Chang Hwa PARK ,  Hyun Hu LEE

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board includes a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a cavity; and a first barrier layer having at least a portion disposed between the first and second insulating layers and in contact with a side surface of at least a portion of the first wiring layer.

公开(公告)号：US20250107008A1

公开(公告)日：2025-03-27

申请号：US18783666

申请日：2024-07-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Hu LEE ,  Jong Eun PARK ,  Chang Hwa PARK ,  Sang Ho JEONG ,  Sang Won HAN ,  Deok Hong JO

IPC: H05K3/40 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34

Abstract: A printed circuit board includes a wiring portion including one or more insulating layers, one or more wiring layers respectively disposed on or in the one or more insulating layers, a first pad disposed on a lowermost insulating layer, of the one or more insulating layers, and a second pad disposed on an uppermost insulating layer, of the one or more insulating layers, a first solder resist layer disposed on a lower side of the wiring portion to cover at least a portion of the first pad, the first solder resist layer having a first opening, on the first pad, a second solder resist layer disposed on an upper side of the wiring portion to cover at least a portion of the second pad, a first surface treatment layer disposed on at least a portion of the first pad, and a barrier layer disposed on the first solder resist layer.

公开(公告)号：US20250081338A1

公开(公告)日：2025-03-06

申请号：US18769762

申请日：2024-07-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Ho JEONG ,  Jong Eun PARK ,  Chang Hwa PARK ,  Hyun Hu LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: A printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. In a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.

公开(公告)号：US20250016921A1

公开(公告)日：2025-01-09

申请号：US18629159

申请日：2024-04-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Ho JEONG ,  Jong Eun PARK ,  Chang Hwa PARK ,  Hyun Hu LEE

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer disposed on an upper side of the first insulating layer, a second metal layer disposed on a lower side of the first insulating layer, and a first via layer penetrating through at least a portion of the first insulating layer to connect the first metal layer to the second metal layer. The first via layer has a tapered shape becoming narrower toward a top of the first insulating layer, and an upper surface of the first metal layer is substantially flat, and a side surface of the first metal layer has a curved surface.