公开(公告)号：US20200211770A1

公开(公告)日：2020-07-02

申请号：US16812933

申请日：2020-03-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan SON ,  Jong Duck KIM ,  Dae Heon JEONG ,  Ho Yoon KIM

IPC: H01G4/12 ,  H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/012 ,  H05K1/18 ,  H01G4/38

Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

公开(公告)号：US20210193385A1

公开(公告)日：2021-06-24

申请号：US16854216

申请日：2020-04-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Sun WON ,  Jong Duck KIM ,  Hae Suk CHUNG ,  Jae Joon YU ,  Won Woo CHO ,  Ki Hong KIM

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G4/40

Abstract: By controlling shapes of internal electrodes, when short-circuit occurs between the internal electrodes, a short-circuited portion may be opened by an overcurrent, to serve as a fuse. Also, by controlling shapes of internal electrodes, equivalent series inductance (ESL) at a high frequency may be reduced.

公开(公告)号：US20190066919A1

公开(公告)日：2019-02-28

申请号：US16001338

申请日：2018-06-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan SON ,  Jong Duck KIM ,  Dae Heon JEONG ,  Ho Yoon KIM

IPC: H01G4/12 ,  H01G4/005 ,  H01G2/06 ,  H01G4/30

Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

公开(公告)号：US20210202176A1

公开(公告)日：2021-07-01

申请号：US16864653

申请日：2020-05-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Woo CHO ,  Jong Duck KIM ,  Jae Sun WON

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/40 ,  H01G4/12 ,  H01G2/06

Abstract: A multilayer electronic component includes a body including dielectric layers, and first and second internal electrodes alternately stacked in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, a resistor disposed on the second surface, a via electrode exposed to the second surface and connecting the second internal electrode and the resistor to each other, a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the resistor.

公开(公告)号：US20190189348A1

公开(公告)日：2019-06-20

申请号：US15973211

申请日：2018-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Woo Jin CHOI ,  Young Ghyu AHN ,  Jong Duck KIM

IPC: H01G4/232 ,  H01G4/224

Abstract: A capacitor component includes: a body having a first main surface and a second main surface facing each other in a thickness direction and side surfaces facing each other in a length direction and connected to the first and second main surfaces, the body including a plurality of dielectric layers and a plurality of internal electrodes stacked in the thickness direction and alternately exposed through the side surfaces of the body with each of the plurality of dielectric layers interposed therebetween; and external electrodes disposed on the side surfaces and the second main surface of the body and electrically connected to the plurality of internal electrodes.