公开(公告)号：US20190069410A1

公开(公告)日：2019-02-28

申请号：US15959993

申请日：2018-04-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Kyung Hwa YU ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

公开(公告)号：US20240222026A1

公开(公告)日：2024-07-04

申请号：US18243250

申请日：2023-09-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Heon JEONG ,  Soo Hwan SON ,  Young Ghyu AHN

IPC: H01G4/232 ,  H01G4/30 ,  H05K1/18

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H05K1/181 ,  H05K2201/0212 ,  H05K2201/10015 ,  H05K2201/10636

Abstract: A composite electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, a first external electrode disposed on the third surface and extending onto at least a portion of the first surface, a second external electrode disposed on the fourth surface and extending onto at least a portion of the first surface, a first insulating substrate disposed on a portion of the first external electrode disposed on the first surface, and a second insulating substrate disposed on a portion of the second external electrode disposed on the first surface, wherein the first and second insulating substrates each include a plurality of spherical particles including a resin.

公开(公告)号：US20200253057A1

公开(公告)日：2020-08-06

申请号：US16856444

申请日：2020-04-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Kyung Hwa YU ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002 ,  H01G4/40 ,  H01G2/06 ,  H05K3/30

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

公开(公告)号：US20190066919A1

公开(公告)日：2019-02-28

申请号：US16001338

申请日：2018-06-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan SON ,  Jong Duck KIM ,  Dae Heon JEONG ,  Ho Yoon KIM

IPC: H01G4/12 ,  H01G4/005 ,  H01G2/06 ,  H01G4/30

Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

公开(公告)号：US20180182558A1

公开(公告)日：2018-06-28

申请号：US15644178

申请日：2017-07-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Dae Heon JEONG ,  Kyung Hwa YU ,  Min Kyoung CHEON ,  Soo Hwan SON

IPC: H01G4/40 ,  H01G4/30 ,  H01G4/248 ,  H05K1/18 ,  H05K1/11 ,  H01G4/012 ,  H02H9/04

CPC classification number: H01G4/40 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/33 ,  H01L23/60 ,  H01L24/16 ,  H01L2224/16235 ,  H01L2924/15311 ,  H02H9/045 ,  H05K1/0213 ,  H05K1/0259 ,  H05K1/111 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/611

Abstract: The composite electronic component includes: the capacitor including a body in which a plurality of dielectric layers and internal electrodes facing each other, with the dielectric layer interposed therebetween, are stacked, and the ESD protection device including first and second lead electrodes disposed on the body of the cpacitor, a discharge part disposed between the first and second lead electrodes, and a protection layer disposed on the first and second lead electrodes and the discharge part; an input terminal connected to the internal electrode of the capacitor and the first lead electrode of the ESD protection device; and a ground terminal connected to the internal electrode of the capacitor and the second lead electrode of the ESD protection device. G2/G1

公开(公告)号：US20200211770A1

公开(公告)日：2020-07-02

申请号：US16812933

申请日：2020-03-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan SON ,  Jong Duck KIM ,  Dae Heon JEONG ,  Ho Yoon KIM

IPC: H01G4/12 ,  H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/012 ,  H05K1/18 ,  H01G4/38

Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

公开(公告)号：US20200092999A1

公开(公告)日：2020-03-19

申请号：US16691787

申请日：2019-11-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Kyung Hwa YU ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

IPC: H05K1/18 ,  H01G4/40 ,  H01G2/06 ,  H05K3/30 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

公开(公告)号：US20190180945A1

公开(公告)日：2019-06-13

申请号：US15974285

申请日：2018-05-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon KIM ,  Kyung Hwa YU ,  Man Su BYUN ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

IPC: H01G4/40 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/224 ,  H02H9/02

CPC classification number: H01G4/40 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/224 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H02H9/02 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/2045

Abstract: A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.

公开(公告)号：US20190069412A1

公开(公告)日：2019-02-28

申请号：US16001510

申请日：2018-06-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon KIM ,  Kyung Hwa YU ,  Man Su BYUN ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H05K1/11

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05≤A1/A1≤0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.

公开(公告)号：US20190066918A1

公开(公告)日：2019-02-28

申请号：US15994871

申请日：2018-05-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Heon JEONG ,  Young Ghyu AHN ,  Ho Yoon KIM ,  Man Su BYUN ,  Soo Hwan SON

IPC: H01G4/12 ,  H01G4/005 ,  H01G2/06 ,  H01G4/30

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.